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Politics : Formerly About Applied Materials

AMAT 268.79

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Jan 2 3:59 PM EST

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To: FJB who wrote (40686)	12/11/2000 8:49:07 AM
From: Proud_Infidel	Read Replies (1) of 70976

Trecenti Technologies Succeeds in Volume Production Trial of 300mm Wafers December 11, 2000 (TOKYO) -- Trecenti Technologies Inc. announced that it has succeeded in processing 300mm wafer chips at its pilot volume processing line. According to the company, it was to launch the pilot line for the 300mm wafer volume production in January 2001, but it forwarded its original plan by one month to Dec. 1, 2000. It produced 4Mb and 8Mb SRAMs using 0.18-micron process technology. The company's original plans were to start trial manufacturing on the pilot line in January 2001, and to start volume production in April 2001. If there is no delay in the schedule, it will be the first 300mm wafer volume processing line in the world. Because of that, the progress of Trecenti Technologies' efforts in 300mm-wafer volume production are drawing keen attention of many rival makers and production equipment makers. By the end of August 2000, Trecenti Technologies had completed the first step of its interior of the dust-free facilities, and had started installing the production equipment. Followed by the success of the pilot line, it indicated again the steady development of 300mm wafer volume processing lines. Related story:Taiwan's UMC to Leverage 300mm Wafers, 0.13-Micron Technology in 2001 (Nikkei Microdevices)

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