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Gold/Mining/Energy : Silver prices

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To: TheBusDriver who wrote (3196)12/20/2000 9:37:55 AM
From: long-gone  Read Replies (1) of 8010
 
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Alloys
Solder Alloys and the Industries They Serve

ALLOY
MELTING RANGE (°C)
INDUSTRY SERVED

SnAg
221 -226
Automotive

SnAgBi
206 - 213
Military/Aerospace

Consumer

SnAgBiCu
-
Military/Aerospace

SnAgBiCuGe
-
Consumer

SnAgBiX
206 - 213
Consumer

SnAgCu
217
Automotive

Telecommunications

SnBi
138
Consumer

SnCu
227
Consumer

Telecommunications

SnZn
198.5
Consumer


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Some Industry Organizations
and the Alloys They're Investigating

ORGANIZATION
ALLOY

NEMI
SnCu0.7
SnAg3.5
SnAgCu

NCMS
SnAg3.5
SnBi58
SnAg3.2Bi2.0
CASTIN
SnAg3.4Bi4.8
SnIn20Ag2.8 (Indalloy)
SnAg3.5Cu0.5Zn1.0

ITRI
SnAgCu
SnAg2.5Cu0.8Sb0.5
SnCu0.7
SnAg3.5
SnBiAg
SnBiZn


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Alloy Material Cost, As Compared
to Eutectic Tin-Lead Solder

ALLOY
PRICE MULTIPLIER REFERENCED TO TIN-LEAD*
USE

SnAgCu
2.2 to 2.7
Considered a benchmark

SnCu
1.5
Low-cost alternative for wave soldering

SnAgBi
2.2 to 2.7
Possible Pb replacement (especially for SMT).

Bi concern for SnPb finish boards.

Avoid any Pb!

SnZn
2.2 to 2.7
Concerns with corrosion resistance.

Requires special fluxes.

No long-term reliability data available.

SnAg
2.2 to 2.7
Extensive data


*NOTE: Price is compared to SnPb at current metals market price.

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Lead-Free Solder Alloys

Potential alloys with high percentage of tin:

+silver (Ag) 0.1 to 5.0%
+bismuth (Bi) 1.0 to 5.0%
+antimony (Sb) 0.2 to 5.0%
+copper (Cu) 0.2 to 2.0%
+zinc (Zn) 0.5 to 9.0%
+indium (In) 0.5 to 20.0%
+magnesium (Mg) 0.5 to 2.0%

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Common Alloys Being Used or
Evaluated to Replace Lead
& Their Melting Points

Sn96.5Ag3.5 (221 C)
Sn95Sb5 (232-240 C)
Sn95.5Ag3.8Ci0.7 (~217 C)
Sn95.8Ag3.5Cu0.7 (~217 C) NIST Alloy
Sn99.3Cu0.7 (227 C)
Sn96.2Ag2.5Cu0.8Sb0.5 (213-218 C)
Sn97Cu2.0Sb0.8Ag0.2 (226-228 C)
Sn91.8Ag3.4Bi4.8 (202-215 C)
Sn42Bi58 (138 C)

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Physical Properties
of Lead-Free Alloys: I

High tin content alloys like Sn90+:
+ Typically have much higher melting points than traditional Sn63Pb37
+ Are stronger and less ductile than lead or Indium-bearing alloys
+ Typically exhibit poor wetting when compared to Sn63Pb37

Moderate bismuth content alloys:
+ Typically have lower melting points than Sn63Pb37
+ Typically are very brittle
+ Wetting and joint appearance is relatively poor

Physical Properties
of Lead-Free Alloys: II

Effect of certain elements such as copper on high tin content solder: (as in Sn95.5Ag3.8Cu0.7):
+ Retards the dissolution rate of copper.
+ Can improve the wettability.
+ Can improve the thermo-mechanical properties of solder joints.
+ Reduces the melting point slightly.

Indium-bearing solders compare favorably to lead-bearing solders. Both are ductile materials.

Typically, indium-bearing solders (e.g., Sn48In52) tend to be slightly expensive compared to other alternatives.

Indium-bearing solders are often used when soldering to gold substrates. Note that where Sn-Au intermetallics are brittle, Au-In intermetallics are relatively thin and much more tolerant of thermal cycling.

Bi-containing Alloys

Fatigue life is reduced when soldered to hot air solder leveled (HASL) boards.

Lead from Hot Air Leveling (HAL) coatings can diffuse through the grain boundaries of alloy.

This lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries.

The melting point of the eutectic alloy is 95 °C.

The overall result is a large decrease in the strength of the joint.

Fillet lifting of PTHs due to pasty range (206-213 °C)

Avoid any Pb!!

The Effect of Lead on Sn42Bi58

Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy.

This lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries.

The melting point of the eutectic alloy is 95 °C.

The overall result is a large decrease in the strength of the joint.

In-containing Alloys

In reduces the melting temperature of an alloy

In alloys offer good strength and physical properties

In very expensive and in short supply

Also forms a ternary compound with SnPb finishes that has a phase change at 114°C.
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