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Politics : Formerly About Applied Materials

AMAT 252.25

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Nov 28 9:30 AM EST

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To: Proud_Infidel who wrote (41151)	12/27/2000 11:11:30 AM
From: Proud_Infidel	Read Replies (1) of 70976

TSMC Begins Shipping 300mm IC Wafers from Pilot Line December 27, 2000 (TOKYO) -- Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) began shipping 300mm wafers from its pilot volume-production line. It's the world's second company to start such a plant, following Infineon Technologies AG of Germany. According to the announcement, advanced the original schedule for delivering 300mm wafers to customers, due to the good yield of its first processed wafers, which had better-than-expected initial values. It carried out its first delivery of 300mm wafers within 2000. "By achieving better yields and cost reductions for 300mm wafer processing, 300mm wafer processing will become the mainstream, and by delivering 300mm wafers TSMC has clearly demonstrated its world-class processing capability," said F.C. Tseng, president of TSMC. TSMC utilized 0.18-micron process technologies for its 300mm wafer processing, and used the JEDEC test wafers to verify and evaluate the process module and electrical performance characteristics. Related stories: TSMC to Process 300mm Wafers at 50 Percent of Full Capacity in 2005 TSMC Begins Processing 300mm Client Product Wafers Taiwan's Mosel to Ramp Up Two Lines for 300mm Wafers (Nikkei Microdevices)

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