This sounds like a good thing...
Dense-Pac's Stacking Memory Technology Designed Into Compaq Proliant Network Server
GARDEN GROVE, Calif., Jan 18, 2001 (BUSINESS WIRE) -- Dense-Pac Microsystems Inc. (Nasdaq: DPAC chart, msgs), a leading-edge provider of high-density semiconductor packaging solutions, Thursday announced the immediate availability of its stacking technology for use in Compaq Computer Corp.'s new ProLiant DL320 network server.
The DL320 is a single processor, 1U (1.75-inch) high server, and the newest addition to the Density Optimized ProLiant (DL) family. Ultra-dense server design enables customers to quickly deploy and manage Web hosting, video streaming, and other Internet-related applications. The server will support up to 2GB of ECC-protected memory.
According to Dense-Pac's chief executive officer, Ted Bruce, "Dense-Pac's high-density stacking technology provides our customers with an economically efficient method of maximizing their system memory. We have seen the requirements for memory density increase as network servers' and workstations' systems expand.
"Our technology allows increased memory capabilities within new and existing high-end computer systems. Additionally, Dense-Pac continues to invest in research and development for the next generation of stacking technology that includes DDR, DSP and mixed stacking technologies, all of which are expected to be in full production in this calendar year."
About Dense-Pac Microsystems Inc.
Dense-Pac Microsystems is a technology company that provides high-density electronic design and manufacturing solutions using its proprietary, patented, three-dimensional packaging. High-density design and manufacturing allows customers to meet their electronic system performance and time-to-market objectives for maximum system integration.
DPAC's products are used in applications such as network servers, computers storage devices, medical instrumentation and communication devices. The company's Web site is at www.dense-pac.com.
This news release includes forward-looking statements, including statements regarding the management's current beliefs concerning company's market, technology development, expansion and business plans, utilization of the described product into the end system, the success of the server system in the marketplace, the need for emulation technology, which are subject to change as a result of various risks or uncertainties. Every statement herein that is not historic in nature is a forward-looking statement. The actual results may materially differ from those described in any forward-looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended Feb. 29, 2000 or subsequent Forms 10-QSB.
Contact:
Dense-Pac Microsystems Inc., Garden Grove
Yvonne Huff (investor relations), 714/898-0007
yvonneh@dense-pac.com
or
Wall Street Investor Relations Corp.
Joe Zappulla, 301/907-4090
JoeZ@WallStreetIR.com |
