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Technology Stocks : Intel Corporation (INTC)

INTC 36.82

+1.5%

Dec 19 9:30 AM EST

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To: AK2004 who wrote (127309)	2/13/2001 3:41:27 PM
From: fingolfen	Read Replies (1) of 186894

...implement .13 while improving the yields in order to make p4 as cost effective as pIII by the end of the year. 300mm would make it less of an issue... You're clearly the target audience for these hack analysts who know nothing about semiconductor fabrication... 1) There is no credible evidence anywhere that indicates P4 yields are bad... 2) The article in question assumes because the P4 die is twice is big... it's yield is half that of the P3... which is an invalid assumption... even if it was a valid assumption, shrinking the die to the size of the P3 (which 0.13 micron does) would eliminate the alleged source of yield loss. 3) 300 merely increases the number of die per wafer... it doesn't improve yield which is good die as a function of total possible good die/wafer. If you, however, have matched yields on a 200mm vs. a 300mm process, Intel has indicated you realize a 30% cost per die savings. This will improve Intel's margins handsomely.

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