Intel Corporation (INTC) Message Board

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Technology Stocks : Intel Corporation (INTC)

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Nov 28 9:30 AM EST

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To: Joe NYC who wrote (127797)	2/19/2001 12:44:39 AM
From: Ali Chen	Read Replies (1) of 186894

"What's the approximate relation between the processor case temperature and the die temperature?" Joe, The exact data for P4 package are not published AFAIK. As a guess, the P4 die is covered by a copper heat cup (or spreader), about 0.5mm thick. Given the copper conductivity at 4 W/cm/K and assuming about 100W/cm power density, the temperature difference across the cup should be less than 1K. Taking into account some mechanical deviations, I guess the difference between the "die surface" temperature (in AMD definition) and the "case surface" should not exceed 3 degrees C. Regards, - Ali

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