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Technology Stocks : Intel Corporation (INTC)

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To: Joe NYC who wrote (127797)	2/19/2001 1:24:37 AM
From: Mani1	Read Replies (1) of 186894

Jozef re <<What's the approximate relation between the processor case temperature and the die temperature?>> The resistance of the thermal lid itself is less than 1 degree, the main temperature rise happens in the interface which is filled with sliver paste. That conductivity can be as much 90,000 W/m^2.k, so with die power density of...errr... 50 W/cm^2, then total temp rise is 6 degrees. If the die size is reduced (power density increasing), then it gets that much more difficult. So bigger the die, the easier it is to cool it. Mani

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