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Microcap & Penny Stocks : All American Semiconductor (semi)
SEMI 30.57+0.5%Nov 21 4:00 PM EST
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To: Arthur Tang who wrote (935)2/21/2001 6:34:00 AM
From: Arthur Tang  Read Replies (1) of 952
 
Recent personal research on the performance of 0.25 submicron technology on the AMD K6-2 cpu points out the production problems in general. The new crop of 0.15 submicron semiconductors may have the same production problems.

First, residue thermal stress made the devices have limited temperature range that they can be operated. Second, possible water molecules may have been attached to the elements(silicon dioxide and other insulation elements?) used in the devices. When plastic encapsulation is used, the water molecules may be driven out simply by continuous usage. But in cases made of ceramics. the water molecules just migrate around and cause ultimate failure. I am glad most new cpus are encapsulated by plastics. I would recommend all devices be encapsulated by plastics from now on.
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