Semi - here's Intel's original press release stating Fab22 would come up on 200mm wafers in 2001 then progress to 300mm.
intel.com
SANTA CLARA, Calif., Jan. 25, 2000 -- Intel Corporation today announced it will build its first high-volume production manufacturing facility for 300 millimeter wafers, in Chandler, Ariz. The company said it will invest $2.0 billion to build and equip the wafer fabrication facility. The project is contingent upon local governmental approval, expected in the next few weeks.
"This facility will help us maintain our leadership in the extremely competitive world of semiconductors. Fab 22 will give us more manufacturing capacity in order to help us better address our customers' growing need for high performance microprocessors," said Mike Splinter, Intel senior vice president and general manager of the Technology and Manufacturing Group.
The 300 mm (12-inch) wafer offers 225 percent of the silicon surface area (over twice as much surface area), and about 240 percent of the printed die (individual computer chips) per wafer, relative to standard 200 mm (8-inch) wafers used in many semiconductor manufacturing plants today. In addition, the larger wafers will reduce manufacturing costs per wafer by more than 30 percent.
Splinter continued, "Intel plans to bring this fab on line in record time to meet our customers' needs. It will initially begin production using Intel's 0.13-micron process technology with copper metallization on 200 mm wafers in 2001 and transition into the production of 300 mm wafers." A micron is approximately 1/100th the width of a typical human hair. |
