AMD started putting into place copper FAB technology with pod wafer handling equipment two years ago. It's about a third paid for already.
---So, you seem to be of the opinion that this "Pod Transport" is a big deal, it's not. The wafer transport system runs on a monorail near the ceiling, where the laminar airflow from the ceiling is highest. Our microcontamination people did testing, and found no difference between the Pod system, and the standard Wafer Lot Box transport system. The Pod system does have an advantage with 300mm wafers due to the size and weight of the standard 25 wafer box. But of course, AMD wouldn't know about that. Too bad their 200mm system can't be modified for 300mm and will be obsolete then.
50% of AMD's capacity is already equipped for pods, copper, and soon SOI.
Intel is hoping to bring its first smidgen of such capacity on line real-soon-now. They don't know when they can begin to hope for SOI. Intel is two years behind AMD.
---I've seen the data for SOI. If you're looking at this as the holy grail, you're going to be disappointed. To me, it seems to have a slight advantage, but the manufacturing costs are astronomical. Forget about cheap chips on that process.
Sander's timing was brilliant. Barretts's was not.
Dan
---If you say so Dan, after all, you're an expert at semiconductor manufacturing..... Not.
Semi |
