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Technology Stocks : Alliance Semiconductor

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Jul 10 5:00 PM EST

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To: DJBEINO who wrote (9281)	4/18/2001 12:25:08 PM
From: DJBEINO	of 9582

Taiwan Semicon May Delay Equipment Installation At Fab 14 TAIPEI (Dow Jones)--Taiwan Semiconductor Manufacturing Co. (TSM) may delay the installation of equipment at its second dedicated 12-inch wafer fab, company president F.C. Tseng said on Wednesday. The world's largest dedicated chip foundry had planned to move equipment into the Fab 14 plant in the Tainan Science-based Industrial Park during the fourth quarter of 2001. It may now only be able to complete the plant shell and clean room this year, depending on the outlook for the sector. TSMC began equipment installation at its first 12-inch wafer plant - Fab 12 in the Hsinchu Science-based Industrial Park - in early April and plans to begin volume production in the fourth quarter of the year. Tseng said the plant should have a monthly capacity of between 5000 and 6000 12-inch wafers by the end of the year. Meanwhile, TSMC said it has completed basic modules for 0.10 micron process technology, as well as a 12-inch wafer pilot lot using 0.13 micron all copper process technology, achieving a "reasonably good yield."

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