Axcelis Wins Order for High Current and High Energy Ion Implanters From Tower Semiconductor
Systems will include 'Implant Network Option' enabling process optimization and remote operation
BEVERLY, Mass.--(BUSINESS WIRE)--April 23, 2001-- Axcelis Technologies, Inc., (NASDAQ:ACLS - news), today announced it will install multiple systems from its high current and high energy ion implant platforms at Tower Semiconductor Ltd. (NASDAQ:TSEM - news; TASE:TOWER) new Fab in Migdal Haemek, Israel. Tower is an independent wafer manufacturer, strategically focused on advanced Flash memory and CMOS Image Sensor technologies.
The $10 million dollar order includes multiple GSD/200E2 and GSD/VHE implanters. Installation of the first systems is scheduled for July 2001. The new fab, referred to as ``Fab 2'', uses advanced CMOS technology from Toshiba.
``We chose Axcelis because of the economic advantage of their systems and services. Their systems are designed for high productivity, maximum manufacturing flexibility, and they have a track record for strong customer support'' said Ron Niv, Fab 2 manager at Tower.
``Axcelis' GSD Series provides high productivity multi-wafer processing capability across the broadest range of applications. We trust that Axcelis' implanters will help Tower meet the high yield and top quality standards expected by its customers.'' said Mike Luttati, senior vice president and general manager of the ion implantation and rapid thermal systems group of Axcelis. ``The order builds on the long-standing relationship with Tower and the established relationship that SEN has with Toshiba. We look forward to an even stronger relationship as we support Tower's implant process needs at Fab 2.''
Axcelis' line of implanters is built with an integrated design approach. Common components, user interface, and entire subsystems across the product line provide optimal spares, maintenance, and training efficiency. In addition, the mix of implanter architectures, both serial and multi wafer, support overlapping applications, providing the most flexible manufacturing toolset available. The ability to meet the entire range of implant process requirements enables Axcelis to deliver the lowest cost of ownership (CoO) and highest overall equipment effectiveness (OEE).
The ``Implant Network Option'' (INO) feature further enhances the synergy of the tool set. This added capability is designed to aid in process optimization and equipment performance activities. The software allows for remote command and access of data files of multiple implanters from a selected end user's computer workstation. Users of the remote computing software will be able to edit recipes, issue control instructions and access data from the process engineering or maintenance engineering offices without interrupting production operation or host communication.
About Axcelis Technologies, Inc.
Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high energy ion implantation equipment; rapid thermal processing systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as in Toyo, Japan through its joint venture Sumitomo Eaton Nova. The Company's Internet address is axcelis.com.
About Tower Semiconductor
Tower Semiconductor Ltd. is an independent wafer manufacturer, strategically focused on advanced Flash memory and CMOS Image Sensor technologies. Tower provides manufacturing and turnkey services for integrated circuits (IC) on silicon wafers in geometries from 1.0 to 0.35 micron, using its advanced technological capabilities and the proprietary designs of its customers.
Tower recently began construction of an advanced fab adjacent to its current facility in Migdal Haemek, Israel. The new fab, referred to as ``Fab 2,'' will employ approximately 1,000 employees and produce up to 33,000 200-mm wafers per month in geometries of 0.18 micron and below, using advanced CMOS technology from Toshiba. Funding for the project is provided mainly by wafer partners, Israel Corporation - Technologies (ICtech) Ltd. (a fully owned subsidiary of The Israel Corp (TASE: ILCO), and other financial investors, a grant from the Israeli Government Investment Center, bank credit line and Tower's own resources. Wafer Partners include SanDisk Corporation (Nasdaq: SNDK - news), Alliance Semiconductor (Nasdaq: ALSC - news), Macronix International (Nasdaq: MXICY - news) and QuickLogic Corporation (Nasdaq: QUIK - news). For additional information please visit towersemi.com.
microFLASH® is a registered trademark of Tower Semiconductor Ltd. The microFLASH process is based on Saifun NROM(TM) technology from Saifun Semiconductor Ltd.
Safe Harbor
Statements in this press release regarding the timing of the completion of installation of tools covered by the purchase order and other anticipatory statements are forward-looking statements that involve risks and uncertainties. These uncertainties include, but are not limited to technological or business delays or difficulties, and other risks detailed in Axcelis' Form S-1 Registration Statement on file with the Securities and Exchange Commission and in subsequent filings by Axcelis with the Commission.
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Contact:
Company Contact:
Elizabeth Burnside
Axcelis Technologies, Inc.
(978) 787-4273
elizabeth.burnside@axcelis.com
or
Investor Contact:
Jan Paul van Maaren
Axcelis Technologies, Inc.
(978) 787-4000
investor.relations@axcelis.com
or
Agency Contact:
Gabrielle Svenning
The Loomis Group Inc.
(617) 638-0022
gabrielle@loomisgroup.com |
