ptanner,
re: "cutting width"
Its called a scribe lane.
Typically only 100-150 microns.
Most folks measure die size from mid-scribe to mid-scribe so it is included.
Also news on fab utilization:
TSMC warns of grim second quarter
By Sun Pai-yi
EE Times
(04/27/01, 3:55 p.m. EST)
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TAIPEI, Taiwan — Taiwan Semiconductor Manufacturing Co. Ltd. estimates that its second-quarter sales will drop 26 percent from the first quarter and warned that its utilization rate that is likely to fall below 50 percent.
Despite the weak outlook, TSMC chairman Morris Chang said, "the worst is over." As evidence that the company's deceleration is slowing, Chang pointed to TSMC's ratio of orders to shipments. The ratio edged into positive territory in April for the first time in six months, and Chang said that a historical analysis indicates that it should keep rising. And though he didn't discount the possibility that the ratio could go negative again, he predicted the bottom for TSMC will be this month or May.
TSMC registered sales of $1.2 billion in the first quarter, down from $1.6 billion in the preceding quarter. Profits declined 16 percent from the year-ago quarter and slumped 60 percent quarter to quarter.
Industry analysts met Chang's optimism with pessimism, stating that the worst is yet to come. Linda Liu, an analyst from Primasia Securities, reckoned the industry would not see a strong comeback in the third quarter despite the expectation of a seasonal pick-up in the PC sector. "[A] second-half rally is a big if," she said.
One encouraging trend for TSMC was the greater utilization of its advanced process technology and a boost in its average selling prices, which have trended upward since the beginning of 1999. The company said 0.18-micron and finer processes accounted for 18 percent of its volume in the first quarter, up from 7 percent last quarter.
The company expected further increases in usage of cutting-edge processes, which will be helped by the ramp-up of its 0.13-micron process. Despite the slowdown, TSMC and rival United Microelectronics Corp. have been moving aggressively to develop next-generation processes. Last week, TSMC said it had finished the basic design rules for the 0.10-micron node and would work with potential customers to fine-tune the process before launching pilot runs next year.
regards,
Kash |
