PRI Automation Selected to Provide $22 Million Integrated Solution To Automate Tower Semiconductor's New Fab
Contract includes full integration of a complete suite of factory automation products
BILLERICA, Mass., April 30 /PRNewswire/ -- PRI Automation, Inc. (Nasdaq: PRIA - news), a global leader in advanced automation systems, software, and services to the semiconductor industry, today announced it has been selected by Tower Semiconductor (Nasdaq: TSEM, TASE: TOWER) to provide an integrated solution consisting of factory automation systems, software, and services for Tower's new Fab 2 in Migdal Haemek, Israel. Tower is a foundry semiconductor manufacturer, strategically focused on advanced Flash memory and CMOS Image Sensor technologies.
Under the terms of the purchase agreement, expected to total approximately $22 million over four years, PRI will supply Tower with an automated material handling system (AMHS), factory management software products, as well as systems integration and support services including:
Software Systems
PROMIS® manufacturing execution system (MES) software
TransNet(TM) material control software (MCS)
Promis Encore!® modules including Encore! Composer(TM)
Encore! FAbuilder(TM) equipment integration and station control
software
Hardware Systems
AeroTrak(TM) overhead monorail transport systems
TurboStocker(TM) wafer storage systems
Guardian(TM) bare reticle storage systems
Integration Services and Support
Software system architecture, planning and design
Software system implementation and integration services
AMHS planning and design
Installation and post installation services and support
``We selected PRI Automation because of their unique ability to deliver a cost effective integrated solution for our demanding automated material handling, manufacturing control and information management needs,'' commented Ron Niv, manager of Fab 2 operations at Tower.
``This order is significant because it represents a complete solution consisting of hardware, software, and services,'' said Mitch Tyson, PRI's president and CEO. ``PRI is unique in being able to integrate all of these critical components into a solution that improves the productivity of semiconductor manufacturing operations in today's high volume production fab.''
Foundry semiconductor manufacturers are faced with difficult manufacturing challenges because there are a greater variety of products with higher numbers of hot lots in production at any given time, compared with traditional integrated device manufacturers (IDMs). PRI has extensive experience working with the world's largest semiconductor foundries and understands these challenges. The scope of the Tower Semiconductor project gives PRI the opportunity to apply all of its domain expertise in factory automation and factory management software systems to help Tower implement an efficient and productive manufacturing operation.
PRI is responsible for implementing an integrated factory automation environment that will automate the entire manufacturing process. The solution consists of wafer and reticle transportation and storage, factory management software, including material control software (MCS) to manage and direct the wafer and reticle material handling systems, manufacturing execution system (MES) software to direct and control the manufacturing operation, collect in- line data for process control and yield enhancement, and equipment interface software for process tool communication and station control.
PRI will be designing the software systems architecture and providing the software integration and support services required for installing and implementing the PRI supplied software and hardware components into Tower's manufacturing environment. This effort will be enhanced by PRI's significant integration experience working on hundreds of CIM implementation projects around the world.
About Tower Semiconductor
Tower Semiconductor Ltd. is an independent wafer manufacturer, strategically focused on advanced Flash memory and CMOS Image Sensor technologies. Tower provides manufacturing and turnkey services for integrated circuits (IC) on silicon wafers in geometries from 1.0 to 0.35 micron, using its advanced technological capabilities and the proprietary designs of its customers.
Tower recently began construction of an advanced fab adjacent to its current facility in Migdal Haemek, Israel. The new fab, referred to as ``Fab 2,'' will employ approximately 1,000 employees and produce up to 33,000 200-mm wafers per month in geometries of 0.18 micron and below, using advanced CMOS technology from Toshiba. For additional information please visit www.TowerSemi.com.
About PRI Automation
PRI Automation, Inc., headquartered in Billerica, Massachusetts, is the leading global supplier of advanced factory automation systems, software, and service to semiconductor manufacturers and OEM equipment suppliers. PRI is the only company to provide a tightly integrated and flexible hardware and software solution that optimizes the flow of materials and information throughout the fab improving the productivity of semiconductor manufacturing. The company has thousands of systems installed at hundreds of locations throughout the world. For more information visit PRI online at www.pria.com.
Safe Harbor Statement
This release includes forward-looking statements, including, without limitation, statements relating to the expected benefits of PRI Automation products. These forward-looking statements are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include; (i) the manner in which the customer uses the products and integrates them with other third party components; (ii) the ability of the company to continue to successfully develop and market new products and product enhancements on a timely basis; (iii) completing the construction of Tower's new wafer manufacturing facility, (iv) conditions in the market for foundry manufacturing services and in the market for semiconductor products generally, (v) successful completion of the development and/or transfer of advanced CMOS process technologies to be utilized in Tower's new Fab, (vi) market acceptance and competitiveness of the products to be manufactured by Tower using these technologies; (vii) ramp-up at Tower's new fabrication facility. (viii) the cyclicality of the semiconductor industry and the rapid technological change that characterizes the industry in which the Company competes; (ix) uncertainties affecting global markets and currencies, the effects of possible delays by semiconductor manufacturers in the adoption of 300 mm wafer manufacturing and other new technologies, (x) changes in our product sales mix; (xi) competitive factors, such as introduction of new products or technologies by our competitors, and pricing pressures; (xii) the possible impact of any mergers and acquisitions activity by the Company and its ability to successfully integrate and operate any acquired businesses; (xiii) business and economic conditions affecting the semiconductor manufacturing equipment industry generally; (xiv) and other factors identified in our registration statement on Form S-3, file number 333-34584, as filed with the Securities and Exchange Commission on April 12, 2000 and amended thereafter. We assume no obligation to update any forward-looking information contained in this release. |
