McJimbo - Re: ". What's the procedure for AMD to transfer some chip production to a third party fab? Like, drawings, masks, information etc?"
Initially, a suite of test chips is developed (if not already available) and the database tape is sent to the foundry.
Because each foundry has its own lithography equipment and alignment schemes, the foundry generally generates the reticle set and adds their own alignment marks/targets.
The test chips are run through the designated fab process and are then tested using sophisticated parametric testers for measurement of all critical process parameters - threshold voltages, subthreshold conduction, IDsats, leakages, etc., as well as interlayer and intralayer metal defect densities.
The process can then be characterized and a judgment can be made if the existing design (assuming an AthWiper) would have a chance at meeting the design goals - speed, yield, etc.
Believe me - this is not a three day deal - it can take many months just to determine viability.
If AMD is actually doing this, I'd expect them to be desperate.
Moreover - it suggests that Intel is doing the ABSOLUTELY CORRECT THING in BUILDING NEW 0.13 Micron WAFER FABS NOW.
Paul |
