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Technology Stocks : Nokia (NOK)

NOK 6.405

-2.2%

2:55 PM EST

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To: 49thMIMOMander who wrote (11798)	5/22/2001 8:33:43 AM
From: Eric L	Read Replies (2) of 34857

re: IBM 3G Chips Q4 In Volume to Mitsubishi >> IBM And Mitsi. Join To Develop 3G Chips UK Cellular News 22nd May 2001 IBM has announced a technology agreement with Mitsubishi intended to accelerate the introduction of high-performance, low-power microchips for 3G cellular telephones. Under the multi-year joint development agreement, IBM and Mitsubishi Electric are designing radio frequency integrated circuit (RFIC) chipsets for 3G wireless handsets. Designing 3G RFICs with IBM's SiGe technology allows Mitsubishi Electric to combine multiple chips into complex, integrated parts--significantly reducing the number of chips required by its 3G handsets. In addition, IBM's SiGe technology is expected to help the 3G chipsets consume less power, compared to competitive manufacturing technologies, thereby extending cell phone battery life and talk time. IBM will manufacture the chips at its Burlington, Vt. facility and intends to ship the SiGe chipsets in volume to Mitsubishi Electric in 4Q 2001, for incorporation into its next-generation cellular products. << - Eric -

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