At the beginning of the March Q, they had 5,713M in cash and subsequently added $11,394M
Are you sure it wasn't 23.445 million US
sec.gov
This also may be of interest to investors:
THE LUMENON SOLUTION
We design, manufacture and market optical components solutions that
generate, detect, route and control light signals in telecommunications networks
that use light-carrying fiber-optic cables instead of electrical copper wires.
Specifically, our solutions take the form of circuits that have been etched on
silicon chips through a patented sol-gel manufacturing process that we call
PHASIC(TM). By using silicon chips, we can take advantage of standard, high
volume semiconductor production methods and processes. While traditional
fiber-optic component manufacturers combine discrete elements, such as lasers,
lenses and filters, in manually assembled devices, we can achieve the same
functionality in a single integrated chip with our proprietary silicon-based
optical circuitry. The process is similar to the design and production of
microelectronic chips widely used in computers and telecommunication
applications. We have chosen the optical silicon chip for our product
development because we believe that our PHASIC(TM) process will allow us to
address specific market demands, such as:
Scalable, High Volume Production. Our technology permits a wide variety of
optical components to be manufactured using established process steps developed
by the semiconductor industry. These process steps permit rapid production
schedules and offer opportunities for economies of scale.
Higher Performance. The combination of many optical functions on a single
optical chip reduces the losses in optical power that generally occur when light
is processed through a combination of discrete components and allows increased
precision and control over the optical signals.
Compact Size. Because it takes advantage of the compactness of silicon chips,
our technology allows us to reduce considerably the overall size of fiber-optic
components.
Lower Cost. By using high volume processing techniques, our devices benefit from
cost advantages similar to those experienced with high volume electronic silicon
chip manufacturing.
Simplified Packaging. Conventional optical devices require considerable
technical skill and manual manipulation to attach and align the optical fiber.
Our technology allows for a much simpler fiber attachment, resulting in easier
and quicker device packaging and interfacing.
Reliability. Integrating all components and functions onto a single chip reduces
the number of interfaces between separate components, which improves overall
functional reliability.
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