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Microcap & Penny Stocks : INCE - Intercell info???

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To: Jake's mom who wrote (1712)6/13/1997 1:19:00 PM
From: Jamey   of 3358
 
Company Press Release

Source: Intercell Corp.

Intercell Corporation Sets New Direction for Particle Interconnect Subsidiary

DENVER, June 13 /PRNewswire/ -- Intercell Corporation (OTC:BB - news), a technology holding company, today announced a reorganization of its Particle Interconnect subsidiary operations. Charles E. Bauer, Ph.D., Chief Operating Officer of Intercell, is the acting Chief Executive Officer for the Particle Interconnect subsidiary. Steven D. Clark resigned as President of Particle Interconnect Corp. on May 13, 1997. Intercell is actively recruiting an industry expert to replace him.

The strategic direction of Particle Interconnect Corp. is now focused on expedited completion of process demonstration and validation, product performance characterization and rapid market development.

Strategic relationships with major corporations in Japan, the Netherlands, Singapore, Taiwan, Thailand and North America are currently under discussion. If successful, these relationships will facilitate the development of production capacity for a variety of applications on completion of process validation and product specification efforts. There can be no assurance, however, that such discussions will prove successful.

Bauer, a 20-year veteran of the electronics packaging, interconnection and assembly industry, brings an extensive background in strategic technology development and manufacturing operations to Particle Interconnect.

``Lack of strategic focus, to date, has limited the growth opportunity of Particle Interconnect,'' said Bauer. ``Process validation and specification will be completed by the end of 1997. And the establishment of strategic relationships will, if successful, expedite market entry and growth through 1998.''

Particle Interconnect owns a proprietary technology for making high performance, low-cost interconnects for the connector, IC and printed circuit board industries. The technology shows potential to provide a new way of connecting electronic components that will enable manufacturers to enter the next generation of electronics technology.

Denver-based Intercell Corp. currently manufactures and rebuilds electron tubes and is engaged in the design and development of patented particle-coated substrates for integrated circuits.

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SOURCE: Intercell Corp.
Contact: Jenny Herring, Account Executive, or Wayne Brown, Senior Vice President of Carl Thompson Associates, 303-494-5472
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