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Technology Stocks : Axcelis Technologies, Inc. (ACLS)
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To: Capt who wrote (89)6/4/2001 7:04:22 PM
From: Proud_Infidel  Read Replies (1) of 195
 
Axcelis enhances 300-mm asher for virtually all dry-strip applications
Semiconductor Business News
(06/04/01 16:11 p.m. EST)

BEVERLY, Mass.--Axcelis Technologies Inc. here today introduced a second-generation plasma asher for 300-mm wafer fabs. The new FusionES3i system supports nearly all dry-strip requirements for copper, low-k dielectric, deep trench and vias, and other applications in a single tool, said the company.

Axcelis said the enhanced system features an intelligent downstream microwave plasma source with real-time auto-tuning capabilities, which widens the process window for advanced applications while increasing the ash rate by as much as 100%. Other enhancements include an independently controlled RF ion assist and modular pre-chamber load locks, said the company.

"The need for a reliable and versatile dry strip system has become paramount as chip makers introduce a widening array of new materials to 300-mm manufacturing processes," said Michael Dreyer, vice president and general manager of Axcelis' Photoresist Processing Division. He said the new FusionES3i combines a mature 300-mm platform with significant technology enhancements, "such as the intelligent plasma source and ion assist."

"The result is a highly flexible, modular and cost-effective system that allows our customers to use one tool for virtually all of their dry strip needs," he said.

The platform has been designed to be a "bridge tool" between 200- and 300-mm wafer-processing requirements. The first shipments of the FusionES3I are expected to begin in the fourth quarter of 2001.
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