To: June MacNeil (941 )
From: Chris Parenti
Feb 7 1997 1:12AM EST
Reply #944 of 1725
Charles E. Bauer, Ph.D
Professional Experience:
TechLead Corporation Evergreen, colorado (1990-?)
Managing Director of international consulting firm. Specialist in strategic technology
planning, selection and implementation in the field of electronics packaging,
interconnection and assembly. Added emphases in business development, technology
licensing and exchange, international partnering and market/technology interactions.
Coors Advanced Electronics Group Golden, Colorado (1990)
Director, Research and Technology for a group of two subsidiaries and two internal
research organizations of the Coors Ceramics Company. Subsidiaries included
MicroLithics Corporation (Golden, Colorado) and Coors Electronics Packaging
Company (Chattanooga, Tennessee). Other groups included Coors ceramic substrate
facility in Grand Junction, Colorado, the advanced packaging research group in
Golden, Colorado focused on microwave package design and development, and a
joint venture with W.R. Grace and Company (Columbia, Maryland) developing
multilayer aluminum nitride package technology.
MicroLithics Corporation Golden, Colorado (1989)
Director, Research and Technology for copper thick film multilayer fabrication and
surface mount assembly. Operations responsibility for production of substrates and
start up of full surface mount capability. Developed new business opportunities in area
array packaging, three dimensional and ship scale packaging and parallel computer
designs.
Tektronix, Incorporated Beaverton, Oregon (1978-1989)
Integrated Circuit Packaging Operations Manager (1987-1989). Responsible for all
packaging of Tektronix integrated circuits including ceramic, plastic and advanced
technology applications. Managed five groups including Manufacturing, Subcontract,
Maintenance, Manufacturing Engineering and R&D Engineering. Production Planning
and Cost Accounting reported dotted line.
Bipolar Products Packaging Unit Manager (1985-1987). Responsible for packaging of
all Tektronix bipolar integrated circuits. Managed three groups in this operation,
Bipolar Package Manufacturing, Manufacturing Egineering and R&D Engineering. This
function was responsible for packaging, interconnection and assembly of high power
devices. Developed one of the first high power dissipation
(>10 watts) plastic molded packages in the industry.
Engineering Scientific Manager II (1984-1985) responsible for Manufacturing
Engineering and R&D Engineering for integrated circuit operations. Improved
efficiency and productivity by more than 60% through flexible tooling, reduced set up
times and enhanced process programming.
Materials Science/Engineering Manager II/I (1982-1984/1980-1982).
Manager and key technologist in several major R&D programs including polymer thick
film technology and applications (1 patent, 3 trade secrets), printed wiring board
manufacturing and development (2 patents, 5 trade secrets) and front panel and control
hardware development (1 Tektronix technical achievement award).
Materials Scientist/Engineer III (1978-1980). Project engineer for powder coating
process development and introduction and the development and introduction of
advanced, ultra-violet curable solder masks.
Academic Credentials
University of Colorado Boulder, Colorado (1992-?)
Assistant Professor (Adjunct) with dual appointment in Mechanical Engineering, and
Electrical and Computing Engineering. Serve on the dissertation committee for several
graduate students. Director Industrial Relations for the Center for Advanced
Manufacture and Packaging of Microwave, Optical and Digital Electronics.
Responsible for business development and recruitment of new member companies for
the center.
Florida International University Miami, Florida (1991)
Associate Professor (Visiting) in Mechanical Engineering. Planning responsibility for
federally funded research center in electronics packaging, interconnection and
assembly.
University of Portland Portland, Oregon (1985-1989, 1981-1982)
Assistant Porfessor (Adjunct) in Business Administration. Teaching responsiblities in
technology and innovation management, engineering management and creativity
enhancement.
Assistant Professsor (Adjunct) in Mechanical Engineering. Teaching responsibilities for
undergraduate courses in materials science and engineering.
Masters in Business Administration (1988). Major emphasis in Marketing and
International Business.
Oregon Graduate Center Beaverton, Oregon (1980)
Doctor of Philosophy in Materials Science and Engineering. Dissertation topic on
hydrogen embrittlement of high strength, low alloy steels. Special emphasis on point
defects in integrated circuit fabrication and thermodynamics of multi-phase alloys.
The Ohio State University Columbus, Ohio (1975)
Master of Science degree in Metallurgical Engineering. Focus on corrosion science in
biological implants and the application of polymers. Master thesis topic of Langmuir
adsorption isotherms for oxygen on copper using stabilized Zirconia as an ionic
conductor for oxygen partial pressure control.
Stanford University Palo Alto, California (1972)
Bachelor of Science in Materials Science and Engineering. Minor in Philosophy
focused on the philosophy of ethics.
Professional Societies
ISHM, The Microelectronics Society (ISHM)
Founder & General Chair, Pan Pacific Microelectronics Symposium (1996-?)
President, Rocky Mountain Chapter (1995-1996)
Fellow of the Society Award (1993)
National Technical Vice President (1988-1990)
Founder of the ISHM Advanced Technology Workshop Program
Have served on 17 technical program committees as well as an officer of the
Northwest and Rocky Mountain chapters during the past 12 years.
Surface Mount Technology Association (SMTA)
Director and Secretary (1995-1998)
President, Rocky Mountain Chapter (1995-1996)
Initiated joint chapter meetings with ISHM Rocky Mountain
chapter and increased average attendance at chapter meetings from 15 to 55 with
some meetings attracting as many as 140!
ASM International (ASM) (Member since 1971.)
International Electronics Packaging Society (IEPS) (Member since 1983.) Institute of
Electronic and Electrical Engineering (IEEE) (Member since 1993.)
Active in these societies only as speaker/reviewer and occasionally advise them on
techical programming opportunities.
Patents
US Patent #4,566,186, 28 January, 1986, Multilayer Interconnect Circuitry Using
Photoimageable Dielectric.
Pending:
Polymer Thick Film Multilayer "Circuit with Photoimaged, Buried Vias and Through
Holes. (1987)
Low Cost Integrated Circuit Package for High Power Dissipation.
(1988)
Laser Application for Blind and Buried Via Formation in Copper
Thick Film Multilayer Circuits. (1990)
Three Dimensional Packaging for MultiChip Modules. (1993)
Flip TAB Array for MicroPackaging of Integrated Circuits. (1992)
Publications
Has published over 50 technical papers and Presentations in journals and conferences
around the world. Currently General Chair of Pan Pacific Microelectronics Symposium
and Chip Scale Packaging Advanced Technology Workshop. Topics include ceramic
and polymer circuit card design, fabrication and assembly, component placement and
artificial vision, advanced package design, fabrication and assembly, technology
development and engineering training. Recent focus has been on chip scale packaging
(beginning in 1989), area array packaging including BGA and flip chip (beginning in
1987), MultiChip Modules and PCMCIA fabrication and assembly (beginning in
1991) and strategic technology planning selection (beginning in 1991). |
