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Technology Stocks : Intel Corporation (INTC)

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10:57 AM EST

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To: Paul Engel who wrote (138432)	6/30/2001 10:38:18 AM
From: Dan3	Read Replies (2) of 186894

Re: The Tualatin chips are faster and cooler because they use copper interconnect technology and have circuitry built with a smaller 0.13-micron manufacturing process instead of the 0.18-micron process of today's "Coppermine" chips No argument here. But it's not as much cooler as expected. 2 years ago, AMD and IBM were in volume copper production so both companies were in a good position to get some real world experience with smaller feature sizes in a copper process. Both companies concluded that (very roughly) about half the benefit of moving from .18 to .13 would be lost without SOI. And both companies put their money where their test conclusions were by building SOI .13 FABs. For IBM to do this could have been an experiment, but I just can't see AMD going to the risk and expense of implementing SOI unless they were absolutely certain that it would make a big difference. 2 years from now, Intel will be opening up the new FAB they just announced after recently canceling 2 other .13 plain copper FAB projects. My guess is that the planned FAB the replaces the two cancelled FABs will implement SOI - better late than never, eh? Dan

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