Intel to set up 300-mm R&D fab in Silicon Valley, says report
Facility could be seventh 12-inch wafer facility planned by company so far
Semiconductor Business News
(07/05/01 21:41 p.m. EST)
SANTA CLARA, Calif. -- Continuing its rapid expansion into 300-mm wafer-processing technologies, Intel Corp. here is reportedly planning to set up another 300-mm fab, this time in Silicon Valley, according to a new report from Prudential Securities Inc. The new development fab could represent Intel's seventh 300-mm wafer plant to date.
Intel will not comment on the report, but an e-mail newsletter from Prudential Securities said the chip giant plans to convert its 200-mm R&D fab, located near its headquarters in Santa Clara, into a 300-mm development center. The "D2" facility has primarily served as a 0.18-micron R&D fab, using 200-mm (8-inch) wafers. It is now expected to be converted to 300-mm substrates for 0.13-micron technology development by 2002, said the report issued on Thursday.
"Our proprietary field checks reveal that Intel has decided to convert its 200-mm D2 Santa Clara fab to a 300-mm fab in 2002," said the New York-based brokerage firm. "Currently, D2 is ramping Pentium 4 processors at 0.13-micron technology and also builds flash memories," the report added.
When asked if the fab would be converted to 300-mm wafers, an Intel spokesman responded, "We have not made any announcements about [D2]."
The spokesman acknowledged that Intel has completed the fourth module in the D2 plant, which will build chips based on 0.18-micron design rules.
The conversion of the D2 plant could represent the seventh 300-mm (12-inch) wafer facility that is either operating, under construction, or on the drawing boards at Intel. The world's largest semiconductor manufacturer plans to operate three 300-mm fabs in Hillsboro--separate D1C and D1D development fabs and the new "RP1" research facility.
Two months ago, SBN reported that Intel was planning to build the new D1D 300-mm fab (see May 14 story). Intel is also planning dedicated 300-mm production fabs in New Mexico, Ireland, and Arizona.
A significant portion of Intel's record $7.5 billion capital spending budget in 2001 has been earmarked for 300-mm processing lines and new copper-chip technologies.
--Mark LaPedus |
