| PRI Automation Releases Integrated Software Solution For Advanced 200mm and 300mm Semiconductor Manufacturing Facilities P300 Combines Manufacturing Execution System, Advanced Planning and Scheduling, and Tool Connectivity Software for an Integrated Factory Management System
 SAN FRANCISCO, SEMICON West, Booth #6168, July 16 /PRNewswire/ -- PRI Automation, Inc. (Nasdaq: PRIA - news), a global leader in advanced automation systems, software and services for the semiconductor industry, today announced the release of the P300(TM) factory management software solution. P300 integrates key components of a CIM solution and includes all the integration services required to implement and install a complete system. When combined with PRI's TransFab(TM) unified material handling system, chipmakers have a complete, integrated solution that manages all of the wafer and reticle automation systems, as well as the key production data to improve the productivity of both 200mm and next generation 300mm fabs.
 
 ``Time to first silicon is money,'' said Richard Vatcher, vice president and general manager of PRI's Software Division. ``Today's demanding marketplace requires fabs to get up and running as quickly as possible to take advantage of market opportunities. P300 provides a completely integrated, component- based software solution, specifically designed to provide an overall lower cost, a quicker implementation, and a faster semiconductor fab ramp-up. With highly-automated 300mm semiconductor facilities starting to become a reality, manufacturers are demanding a software system that is capable of the highest level of integration -- not only with the tools, but also with other software applications within the fab.''
 
 Because more of the manufacturing process will be automated in 300mm fabs, manufacturers need new tools to let them make more informed business decisions and better manage their production resources. P300 is specifically targeted at the highly automated 300mm fab, but will be equally effective in 200mm fabs in getting the factory up and running in the shortest amount of time. The solution addresses key areas of a fab's CIM environment that will give chipmakers the ability to better manage the huge volumes of manufacturing data generated every day in the world's most complex manufacturing environment.
 
 The P300 software solution integrates key components of PRI's factory management software including PROMIS® MES software platform, the industry's most mature and feature-rich MES solution, Leverage® for Scheduling, a real- time dispatching scheduler that automatically downloads and monitors model and WIP data from the PROMIS MES, Encore!® Composer for factory and process flow routing specifications and Work Flow Manager(TM) which dispatches material movement to TransNet(TM) MCS based on the continually updated factory schedule. No other system provides this level of pre-integration with a full factory scheduler. P300 provides lower overall cost to the customer due to pre-integration of all PRI software products. This greatly reduces the amount of costly systems integration effort while at the same time allows all the CIM components to come on line faster.
 
 Along with the integrated components within P300, PRI offers integration and support services that will help its customers design, install, and support their semiconductor CIM environments.
 
 About PRI Automation
 
 PRI Automation, Inc., headquartered in Billerica, Massachusetts, is a leading global supplier of advanced factory automation systems, software, and service to semiconductor manufacturers and OEM equipment suppliers. PRI is the only company to provide a tightly integrated and flexible hardware and software solution that optimizes the flow of materials and information throughout the fab, improving the productivity of semiconductor manufacturing. The company has thousands of systems installed at hundreds of locations throughout the world. For more information, visit PRI online at www.pria.com.
 
 Safe Harbor Statement
 
 This release includes forward-looking statements, including, without limitation, statements relating to the expected benefits of PRI Automation products. These forward-looking statements are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include; (i) the manner in which the customer uses the products and integrates them with other third party components; (ii) the ability of the company to continue to successfully develop and market new products and product enhancements on a timely basis; (iii) the cyclicality of the semiconductor industry and the rapid technological change that characterizes the industry in which the Company competes; (iv) uncertainties affecting global markets and currencies, the effects of possible delays by semiconductor manufacturers in the adoption of 300 mm wafer manufacturing and other new technologies, (v) changes in our product sales mix; (vi) competitive factors, such as introduction of new products or technologies by our competitors, and pricing pressures; (vii) the possible impact of any mergers and acquisitions activity by the Company and its ability to successfully integrate and operate any acquired businesses; (viii) business and economic conditions affecting the semiconductor manufacturing equipment industry generally; (ix) and other factors identified in our registration statement on Form S-3, file number 333-34584, as filed with the Securities and Exchange Commission on April 12, 2000 and amended thereafter. We assume no obligation to update any forward- looking information contained in this release.
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