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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 207.48

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To: Dan3 who wrote (48641)	7/22/2001 5:58:37 PM
From: dale_laroy	Read Replies (2) of 275872

>Re: Why is AMD's 0.18 micron copper process more advanced than Intel's 0.13 micron copper process? SOI< AMD is not using SOI at 0.18-micron. >Intel's new D1C fab in Hillsboro is completed since March and will go intro production in early 2002 with 300mm wafers.< >That may let them get as many P4's out of a wafer as AMD gets Clawhammers out of a wafer, minimizing their cost disadvantage, but that's all it buys them.< AMD's estimate of Northwood die size versus Clawhammer die size is 140mm2 versus 105mm2. So, a 300mm2 wafer has 2.25x the die area of a 200mm2 wafer, but the Northwood will only be 33% larger than the Clawhammer. Intel will etch more than 1.6 times as many Northwoods per wafer as AMD does Clawhammers, and any decrease in percentage yield resulting from the larger die size of Northwood will be more than offset by the decrease in percentage yield resulting from the use of SOI in Clawhammer. As long as it has such a stark die size advantage, AMD has no need for 300mm wafers whatsoever.

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