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Politics : Formerly About Applied Materials

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To: Ian@SI who wrote (49609)	7/23/2001 3:55:42 PM
From: Proud_Infidel	Read Replies (1) of 70976

UMC-Infineon 300-mm fab in Singapore aims to install gear in Q3 2002 Construction contract goes to Japan's KOA as UMCi prepares to tool first module next year Semiconductor Business News (07/23/01 11:15 a.m. EST) SINGAPORE -- The silicon foundry joint venture between Infineon Technologies AG and United Microelectronic Corp. today announced a construction contract for its 300-mm wafer fab in Singapore. The venture said it is pushing forward with the initial phase of the planned $3.6 billion fab and will begin equipping the first module in the third quarter of 2002. "Our plans for UMCi have been progressing at a rapid pace despite the current industry slowdown," said Chris Chi, president of the joint venture, called UMCi Pte. Ltd. The venture awarded a $106 million construction contract for the 300-mm fab building to Japan's Kajima Overseas Asia Pte. Ltd. (KOA). UMCi said construction will begin immediately for "Singapore's first 300-mm fab project," which is located on a 32-acre site in the country's Pasir Ris Wafer Fab Park. The announcement of the construction contract comes several days after Singapore-based Chartered Semiconductor Manufacturing Pte. Ltd. announced it was delaying its planned 300-mm fab until 2003 because of poor market conditions for foundry services (see July 19 story). UMCi's construction contract award also comes at a time when semiconductor equipment vendors are worrying that 300-mm fab projects could be delayed in the industry's downturn (see July 16 story). Announced late last year, the UMC-Infineon venture broke ground for the 300-mm fab in April, and it plans to build the huge fab facility in two phases. The total planned capacity for the fab is 40,000 twelve-inch (300-mm) substrates per month (see Dec. 14 story).

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