Intel Corporation (INTC) Message Board

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Technology Stocks : Intel Corporation (INTC)

INTC 36.66

+1.3%

Dec 29 3:59 PM EST

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To: deibutfeif who wrote (141076)	8/8/2001 1:49:49 PM
From: dale_laroy	Read Replies (2) of 186894

>Yeah, here's how it works: they take the partial dice at the edges of the wafer, scribe them so they can be matched up with other partials, and then, using a special trade-secret process, bond them together to get functional devices. Hint - itzy, bitzy bonding machines.< Pure nonsense! What they are doing is filling in the outer area with XScale processors. The actual technique is that the mask has P4 processors only in the central square. The four flanking arcs are masked with much smaller XScale processors. They then slice off the four arcs before routing the central square to the die separator, and route the arcs of XScale processors to a different set of die separators.

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