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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 251.82

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3:49 PM EST

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To: combjelly who wrote (50858)	8/12/2001 7:59:28 PM
From: Elmer	Read Replies (1) of 275872

You are correct that the interconnects are not part of the copper process steps. But, and this is assuming that I understand it properly, you have to control the interconnects pretty tightly to get really small Leffs. To insure that there is enough Al to fill the channel, the tolerances need to be much wider than with Cu. Aluminum doesn't get close to the transistor channels. The channel is the area between the p-well and the n-well where current flows when the transistor is "on". There is a gate oxide between it and the poly layer which charges and attracts carriers to the "channel", making it conductive and turning the transistor on. The speed of the transistor is controlled by the channel length and the gate oxide thickness, to a first order approximation. All this is a from a non-expert's view. The devices are connected one to another by metal lines, being either Al or Cu. A question for our resident experts. What determines whether a connecting trace is metal or poly? Is it simply current load? EP

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