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Technology Stocks : Intel Corporation (INTC)

INTC 36.66

+1.3%

Dec 29 3:59 PM EST

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To: Elmer who wrote (141946)	8/19/2001 9:46:48 AM
From: Dan3	Read Replies (1) of 186894

Re: AMD has already spent most of the benefits of a .13u process You're hilarious. Out of one side of your face, you claim that copper is of no benefit on .18, while out of the other side you insist that .18 copper and .13 copper processes produce the same speed chips. Make up your mind. Either AMD was well over a year ahead of Intel getting to a highly beneficial process (and will likely repeat their success with SOI) or AMD is looking forward to a near term performance boost from a simple shrink to .13. If the key to getting good performance out of currently available FAB technology is copper interconnect rather than .13 lithography, then AMD is well over a year ahead of Intel, and Intel's recent technology introduction may represent the last gasp of an exhausted development team. Intel's big new news, copper, is very old news at AMD, where the next meaningful advance in FAB technology is from implementing SOI - another technology where Intel is far, far, behind AMD.

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