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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 214.18-0.5%Dec 31 3:59 PM EST
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To: wanna_bmw who wrote (51715)8/20/2001 9:50:59 PM
From: Mani1Read Replies (2) of 275872
 
bmw RE <<If Intel's heat spreader does such a good job at reducing the thermal liability, doesn't that cancel out the disadvantage of the actual die having a lower tolerance, thus making the argument moot?>>

Intel addition of the heat slug is a thermal liability of 0.03 W/C. AMD does not use the heat slug, it exposes the bare die to be attached to the CPU. Think of the slug as an insulator thus causing the die to run hotter.

But as I explained the slug only induces 2 degrees of delta T, so even if there was no slug, still AMD's die can operate at a higher temperature according to both companies specs. Intel has its reason for using the slug but it is not thermal (obviously), and of course AMD has its reasons for not using it (not thermal because it makes a very small thermal difference). I can't say more than that.

Re <<Besides, isn't the normal temperature for a properly cooled system at the point of contact well below either rated maximum?>>

Tier one OEM's design the thermal solution around the TDPmax and max allowable temperature. So they make sure that if the processor is dissipating max power, then the die temperature is at max allowable temperature, at steady state conditions. That is why I was telling you last week that thermal designer design around the TDPmax. But lets not start that all over again.

Mani
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