Asyst and TSMC Team On Next-generation 300mm Automation Solution
Strategic Collaboration to Expand Capabilities of Asyst's FasTrack(TM) AMHS for High-capacity Intrabay Applications
FREMONT, Calif.--(BUSINESS WIRE)--Sept. 11, 2001-- Further demonstrating its pioneering role in 300mm technology, Asyst Technologies, Inc. (Nasdaq:ASYT - news) today announced it is collaborating with Taiwan Semiconductor Manufacturing Co. (TSMC) on a strategic 300mm fab-transport development project. Under the agreement, Asyst, the leading provider of Standard Mechanical Interface (SMIF)-based manufacturing automation systems, will team with TSMC, one of the world's leading semiconductor foundries, to expand the capabilities of Asyst's FasTrack(TM) automated material handling system (AMHS). The companies' shared goal is to optimize the product for TSMC's cutting-edge 300mm manufacturing vision.
The aggressive four-month project timetable includes key milestones aimed at allowing TSMC to fully optimize Asyst's vehicle-less, continuous-flow transport (CFT) system to meet TSMC's critical 300mm automation objectives: increased capacity, reduced lot-delivery time and maximized tool utilization. The project calls for Asyst to provide TSMC with a FasTrack transport system, which will be installed initially at Asyst's facility in Taichung, Taiwan, to facilitate the joint development work. Extensive performance testing will be conducted to integrate the FasTrack system's ability to significantly increase tool utilization and fab throughput. Like product yield enhancement, proven via Asyst's SMIF technology, these factors represent the next principal ``levers'' in fab productivity and profitability.
Commenting on the cooperative effort between the two companies, C.H. Hung, TSMC's Department Manager of 300mm Manufacturing, stated, ``Asyst has an established track record of working closely with TSMC to understand our critical requirements, and they are a proven leader in addressing the innate challenges associated with manufacturing and handling of costly 300mm wafers. We are pleased to be working with Asyst on this important project that will have a profound effect on the future of 300mm AMHS and manufacturing.''
Dr. Mihir Parikh, Asyst's chairman and CEO, noted, ``Asyst is deeply committed to optimizing our leading technology to meet the needs of IC foundries, which have the industry's most demanding material transport, storage and equipment micro-stocking/buffering requirements. Through this intensive development project, we look forward to enhancing the capabilities of our innovative FasTrack system so that it is fully optimized for TSMC's current and future 300mm automation requirements.''
Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to: the volatility of semiconductor industry cycles, failure to respond to rapid demand shifts, dependence on a few significant customers, the transition of the industry from 200mm wafers to 300mm wafers, risks associated with the acceptance of new products and product capabilities, including our Plus Portal systems, competition in the semiconductor equipment industry, failure to efficiently integrate acquired companies, failure to retain employees, and other factors more fully detailed in the Company's annual report on Form 10-K for the year ended March 31, 2001 filed with the Securities and Exchange Commission on June 19, 2001, as amended.
About Asyst: Asyst Technologies, Inc. is a leading provider of integrated automation systems for the semiconductor manufacturing industry, which enable semiconductor manufacturers to increase their manufacturing productivity and protect their investment in silicon wafers during the manufacture of integrated circuits, or ICs. Through its ``Value-Assured Fab'' strategy, Asyst offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between the process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs. Asyst's homepage is asyst.com
Note to Editors: SMIF and FasTrack are trademarks of Asyst Technologies, Inc. |
