New Study From PRI Automation Finds That Unified Semiconductor Factory Automation Systems Shorten Delivery Times By Up To 66 Percent While Lowering Costs In 300mm Wafer Fabs
PRI invited to present paper at prestigious ISSM Conference, Oct. 8-10, 2001
BILLERICA, Mass., Oct. 8 /PRNewswire/ -- PRI Automation, Inc., (Nasdaq: PRIA, Toronto: PRJ), a global leader in semiconductor factory automation systems, software and services, announced today that a new simulation study performed by its Automation Systems Division found that unified automated material handling systems (AMHS) vastly outperform segregated systems in 300mm wafer fabs, at a lower cost. PRI has been invited to present the results of the study, ``A Comparison of Unified v. Segregated Automation Material Handling Systems for 300mm Fabs,'' at the prestigious International Symposium on Semiconductor Manufacturing (ISSM) conference in San Jose, Calif., Oct. 8-10, 2001.
The model, developed with advanced simulation software, studied the impact of unified v. segregated automation systems in a variety of 300mm wafer fab layouts. Unified systems utilize overhead track systems that run both between and inside process bays in a fab, and are capable of transporting work-in- process between tools and between bays in one movement. Segregated systems utilize separate transport systems within bays and between bays, requiring buffer systems to transfer lots between the transport systems.
The automation systems were compared on several criteria: equipment set, lot delivery times for both normal and hot lots, relative reliability, relative cost and implementation considerations. The results:
Unified automation systems shorten wafer delivery times of normal lots by 32 percent, and hot lots (``rush jobs'') by 66 percent.
The number of wafer moves required in unified systems is a full one- third lower than in segregated systems.
Less equipment is required overall due to lower storage requirements, because unified systems are more efficient in transporting material.
This leads to lower costs, better system reliability and easier system implementation.
Joe Reiss, principal author of the study and PRI's director of Strategic Marketing, noted that although segregated automation systems are still common today, unified automation systems will be status quo in 300mm wafer fabs. ``300mm fabs need complete AMHS systems that provide higher throughput and shorter delivery times than their 200mm counterparts, while simultaneously allowing tool-layout flexibility and ease of reconfiguration and expansion. Our analysis indicates that unified AHMS such as PRI's TransFab(TM) deliver these benefits.''
TransFab, an integrated hardware, software and services solution, is the only unified AMHS currently available for semiconductor manufacturers. PRI pioneered flexible overhead transport systems that shorten the distance work- in-process travels within fabs, thus increasing productivity.
For a copy of PRI's paper or more information on TransFab, please send email to sales@pria.com.
About PRI Automation
PRI Automation, Inc., headquartered in Billerica, Massachusetts, is a leading global supplier of advanced factory automation systems, software, and services that optimize the productivity of semiconductor and precision electronics manufacturers, as well as OEM process tool manufacturers. PRI is the only company to provide a tightly integrated and flexible hardware and software solution that optimizes the flow of products, data, materials and resources throughout the production chain. The company has thousands of systems installed at approximately one hundred locations throughout the world. For more information visit PRI online at pria.com.
Safe Harbor Statement
This release includes forward-looking statements, including, without limitation, statements relating to the expected benefits of PRI Automation products. These forward-looking statements are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include the manner in which the customer uses the products and integrates them with third-party components and the following additional factors: the downturn in the semiconductor capital equipment industry is harming our business; fluctuating demand for our products makes it difficult to manage our business efficiently; we have reduced our workforce in response to the industry downturn and reduced demand for our products and our smaller workforce may be inadequate to handle increased demand for our products; we may continue to experience delays and technical difficulties with new product introductions such as our TurboStocker product; 300mm technology, in which we have invested heavily, is being adopted more slowly than we expected and competition for early 300mm orders is intense; our lengthy sales cycle makes it difficult to anticipate sales; our operating results fluctuate significantly in response to a variety of factors; delay in our shipment of a single significant order could substantially decrease our sales for a period; the application of new accounting guidance under SEC Staff Accounting Bulletin number 101 will result in delayed recognition of revenues from our factory automation systems; we typically charge a fixed price for our factory automation systems and therefore, we are vulnerable to cost overruns; we have a limited number of customers, we do not have long-term purchase agreements with our customers, and the loss, cancellation or delay of an order by any of these customers could harm our business; we must continually improve our technology and develop new products to remain competitive; demand for less expensive semiconductor is increasing pressure to reduce our prices; industry consolidation and outsourcing could reduce the number of available customers; our operations outside North America expose us to special risks of doing business internationally; our investments in the Asia-Pacific market may not be successful; we face significant competition from other automation companies; future acquisitions may disrupt our operations; we are increasingly dependent on subcontractors and one or a few suppliers of certain components, subassemblies and manufacturing processes; the failure of our key suppliers to deliver components on time could harm our business; we depend on our executive officers and other key personnel; our software products may contain defects that could result in claims and harm our business; we may be unable to protect our proprietary technology; others might claim that we infringe their technology; rising energy costs may increase our operating expenses; we are subject to pending class action securities litigation that could be costly to defend, divert the attention of our management and, if determined adversely to us, seriously harm our business; and other factors identified in our registration statement on Form S-3, file number 333-60180, filed with the SEC on May 3, 2001. We assume no obligation to update any forward-looking statements included in this release.
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