SpeedFam-IPEC's Momentum CMP Technology Integrated into Novellus Systems' CIC
Orbital Hard Platen CMP Technology Enables Damascus Alliance Multi-Level Metal Process Integration
CHANDLER, Ariz.--(BUSINESS WIRE)--Oct. 8, 2001-- SpeedFam-IPEC, Inc. (NASDAQ: SFAM - news), a global supplier of high-throughput chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has successfully upgraded its 776(TM) CMP tool to a Momentum(TM) orbital hard platen CMP system at Novellus Systems' Customer Integration Center (CIC) in support of Damascus Alliance copper/low-k dielectric integration programs.
The Damascus Alliance is a group of capital equipment suppliers whose mission is to shorten time-to-market of copper/low-k dielectric devices for integrated circuit manufacturers through leading-edge process integration capability, knowledge and implementation support. Within the Alliance, SpeedFam-IPEC's Momentum is the tool of record for copper CMP, barrier CMP, dielectric buff CMP and post-CMP clean. SpeedFam-IPEC's processes of record at 0.13um and 0.10um for copper and low-k dielectric are in use at the CIC. Located on the Novellus Systems campus in San Jose, Calif., the Customer Integration Center is the central location for Alliance collaboration and joint development. SpeedFam-IPEC is among the founding members of the Damascus Alliance.
SpeedFam-IPEC Chief Technology Officer Saket Chadda said, ``Momentum's orbital hard platen CMP architecture, unique through-the-pad slurry delivery, low downforce and total wafer metrics control have been key to successful completion of multi-level metal process integration for the Alliance. While leveraging its unique ability to enable abrasive-free slurry usage, Momentum has consistently demonstrated superiority in low mechanical stress planarization of advanced low-k films such as Coral and ultra-low-k films such as porous spin-on films.''
Novellus Executive Vice President of Integration and Advanced Development Wilbert van den Hoek said, ``When it comes to seamless integration of CMP into today's complex multi-level copper/low-k metalization schemes, Momentum's technology, combined with the use of abrasive-free slurry, has enabled the Alliance to achieve its mission of integrating the best copper/low-k processes.''
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of next-generation semiconductor devices, with the world's largest installed base. The company also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on NASDAQ under the symbol SFAM. The company's website is www.sfamipec.com.
Novellus Systems Inc.
Novellus Systems Inc., an S&P 500 company, manufactures, markets and services advanced deposition and surface preparation equipment for today's advanced integrated circuits. The company's products are designed for high-volume production of advanced, leading-edge semiconductor devices at the lowest possible cost. Headquartered in San Jose, Calif., with subsidiaries throughout the U.S. as well as in the United Kingdom, France, Germany, The Netherlands, Spain, Ireland, Israel, China, Japan, Korea, Singapore and Taiwan, Novellus is a publicly traded company on the Nasdaq stock exchange (Nasdaq: NVLS - news) and a component of the NASDAQ-100 Index®. Additional information about the company is available on Novellus' home page at www.novellus.com.
This news release contains forward-looking statements related to our Momentum(TM) product. These statements are subject to known and unknown risks and uncertainties. Actual results may vary. Even if customers react positively to Momentum, this response may not translate into sales of Momentum on the scale or in the time frame that we anticipate. Momentum may not continue to perform as it has up to now, due to unforeseen technical problems. Current market conditions in the semiconductor industry may cause potential purchasers of Momentum to delay investment in new equipment. See SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001, and the Quarterly Report on Form 10-Q filed on April 6, 2001, for additional risks affecting the company. |
