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Technology Stocks : Alliance Semiconductor
ALSC 0.8100.0%Jul 10 5:00 PM EST

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To: DJBEINO who wrote (9522)10/11/2001 12:50:58 AM
From: DJBEINO   of 9582
 
Taiwan Winbond plans to delay wafer plant - papers
TAIPEI, Oct 10 (Reuters) - Taiwan memory chip maker Winbond Electronics <2344.TW> plans to delay a T$120 billion 12-inch fabrication plant due to a dismal market for DRAM (dynamic random access memory) chips, local papers reported on Wednesday.



The Commercial Times quoted Winbond chairman Arthur Chiao as saying weakening DRAM prices, which showed few signs of a rebound in the near term, was one of the reasons to put off the project. Construction was originally planned to begin next year.

Winbond officials were not immediately available for comment on Wednesday.

The decision by Winbond came after Nanya Technologies

<2408.TW> said it would delay a T$8 billion overseas share issue which could force Nanya to delay completion of a cutting-edge manufacturing plant using 12-inch silicon wafers.

Major Taiwan semiconductor makers are treading more cautiously about expansion following the suicide attacks on the United States as uncertainty deepened over when the struggling electronics industry would improve.

On Tuesday, Winbond shares added T$0.60 or the daily seven percent limit to end at T$9.85, outperforming a 2.80 percent rise in the wider TAIEX <.TWII> market.

(US$1 = T$34.6)
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