300-mm investments remain relatively strong despite downturn, says report
Semiconductor Business News
(10/16/01 12:09 p.m. EST)
NEW TRIPOLI, Pa. -- While semiconductor capital spending is in down sharply from last year, investments in 300-mm wafer processing tools are expected to grow 39% in 2001 to $11.4 billion compared to $8.2 billion in 2000, said a new report from The Information Network here.
The report, released today, predicts that the growth in 300-mm equipment purchases will slow to an increase of 16.7%, reaching $13.3 billion worldwide in 2002. The report said revenues for 300-mm systems will represent 48.2% of all frontend fab tools in 2002.
"Some of this equipment has been and will be bridge tools, able to process 200-mm and 300-mm wafers," said analyst Robert N. Castellano, president of the New Tripoli-based research firm.
"The strong growth of 300-mm fabs and fab equipment in 2001, during a precipitous drop in the overall semiconductor industry, is due to the substantial savings of up to 40% that could be realized by 300-mm chip production," Castellano said. "That trend will continue in 2002 as chip manufacturers move to smaller feature sizes to remain competitive and build on a 300-mm platform to further reduce costs."
While the report indicates that 300-mm budgets are leading the pack, some vendors have reported delays in purchases and cancellations of some orders during recent months. But most suppliers and analysts believe the 300-mm movement will gain strength once chip makers resume investments in production facilities.
A new forecast from the Semiconductor Equipment and Materials International (SEMI) trade group now shows worldwide spending on chip production systems falling 35% in 2001 after surging 87% in 2000. In the first half of 2001, chip equipment revenues were down 16.1% to $18.3 billion compared to $21.8 billion in the same six-month period last year, said SEMI during a press conference today at the Semicon Southwest trade show in Austin, Tex. SEMI is currently predicting 11% growth in semiconductor equipment spending next year. |
