SpeedFam-IPEC Names Technology Executive Robert Carey Vice President of Research & Development
CHANDLER, Ariz.--(BUSINESS WIRE)--Oct. 16, 2001--SpeedFam-IPEC, Inc. (NASDAQ:SFAM - news), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has announced the appointment of Robert Carey as vice president of research and development for the company's CMP Group. Reporting to President and Chief Executive Officer Richard J. Faubert, Carey will direct research, development and engineering functions for all CMP tool programs. Most recently, Carey was senior vice president of technology at Chelmsford, Mass.-based Brooks Automation, Inc., a leading supplier of integrated tool and factory automation solutions for the global semiconductor industry.
With more than 30 years of engineering leadership experience, Carey has extensive background in international operations, new product development and organizational re-engineering.
Prior to his tenure at Brooks Automation, Inc., Carey held executive management positions at public and privately-held technology firms in the United States and Europe, including General Signal, Amray and Philips.
``SpeedFam-IPEC's reputation as a CMP innovator was built on our long-term investment in engineering,'' Faubert said. ``From the beginning, our commitment to research and development has been steadfast. And, that commitment hasn't flagged during the current industry downcycle. The addition of a seasoned technology executive like Robert Carey to SpeedFam-IPEC's senior management team is an indication of our confidence in, and our commitment to, success at the next upturn. Robert's proven semiconductor track record will be a powerful asset as we continue to ramp for future growth.''
Carey holds a master of science degree in Systems Engineering and a bachelor of science degree in Electrical Engineering from the University of Strathclyde in Glasgow, Scotland.
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With an extensive worldwide installed base, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on NASDAQ under the symbol SFAM. The company's website is www.sfamipec.com.
This news release contains forward-looking statements about the next upturn and our success at the next upturn. These statements are subject to known and unknown risks and uncertainties. Actual results could differ. The economic downturn may continue longer than anticipated. The CMP market may not grow. We may not be able to maintain or increase our share of the CMP market due to many factors. We may encounter problems introducing Momentum, such as not having adequate manufacturing capacity, technological problems and lack of customer acceptance. We may not be able to achieve the high levels of customer satisfaction to obtain repeat business from existing customers. We may not be successful in our efforts to develop new accounts. See SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001, and the Quarterly Report on Form 10-Q filed on October 11, 2001, for additional risks affecting the company. |
