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Technology Stocks : Intel Corporation (INTC)

INTC 36.15

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Dec 24 12:59 PM EST

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To: maui_dude who wrote (146699)	11/2/2001 10:46:46 PM
From: Elmer	Read Replies (1) of 186894

From a density/routing standpoint, more metal is helping. But from an RC delay standpoint, interconnect RCs are scaling down a lot less than device caps as the process gets smaller. So overall, interconnects are increasingly becoming more problametic than the devices. Repeater insertion to boost the signal on an interconnect is getting to be a major effort during the design process. Maui - thanks for your insights. So how does this effect density? More buffers/repeaters, I'm sure it's a pain in the butt for layout and timing anaylsis but does this have a measurable effect on die size? EP

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