Formerly About Applied Materials Message Board

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Politics : Formerly About Applied Materials

AMAT 256.89

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Dec 31 3:59 PM EST

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To: StanX Long who wrote (56755)	12/1/2001 9:01:52 PM
From: StanX Long	Read Replies (2) of 70976

Shift to 450-mm wafers pushed out to 2013, says ITRS roadmap By Mark LaPedus Semiconductor Business News (11/30/01 12:59 p.m. EST) siliconstrategies.com SANTA CLARA, Calif. -- While IC technology is expected to accelerate over the next several years, the shift to 450-mm wafers in chip manufacturing is not projected to take place until 2013--which is much later than some had predicted. Two years ago, an executive from International Sematech predicted that chip makers would move from 300- to 450-mm wafers in IC production sometime in the 2008 timeframe. Now, it appears that the shift for "high-volume" chip projection based on 450-mm (18-inch) diameter wafers will take place in 2013, according to the new 2001 International Technology Roadmap for Semiconductors (ITRS).

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