Why does Intel need so many FABs?
[edit - I've identified the Hudson FAB as FAB 17, thanks for the info]
I've tried to pull together information on clean room sizes, any assistance that can be given by others would be appreciated. All sq. ft. listed are for cleanroom only!
Keep in mind that CPU market share is about 3 to 1 Intel to AMD at the present time, but AMD has excess capacity at Austin, while Intel, either due to insufficient FAB space or poor yields is capacity constrained. (the large size of P4's die hurts, but the very small size of Celeron, PIII, Mobile PIII, and PIII Xeon helps)
AMD has;
SDC - 46,000 sq. ft. (development FAB)
FAB 25 - 120,000 sq. ft.
FAB 30 - being expanded from 90,000 to 120,000 sq. ft.
FASL 1 - 70,000 sq. ft.
FASL 2 - 114,000 sq. ft.
FASL produces 150% [more recently, 125%] of the flash volume that Intel produces. AMD and Fujitsu each sell parts from the joint venture, and each has about 3/4 the market share of Intel in flash. So Intel needs about 150,000 sq. ft. of FAB space to produce flash.
Intel FABs:
So, we have
D1A - ?
D1BR - 200,000 sq. ft. (once development, now production)
D1C - 135,000 sq. ft. (once development, now production)
D2 - ?
FAB1 - ?
FAB2 - ?
FAB4 - now a new FAB, despite the low number
FAB5 - ?
FAB6 - ?
FAB7 - 435,000 sq. ft.
FAB8 - ?
FAB9 - ?
FAB10 - ?
FAB11 - ?
FAB12 - 135,000 sq. ft.
FAB14 - ?
FAB16 - ?
FAB17 - 95,000 sq. ft. - Hudson Mass FAB
FAB18 - ?
FAB20 - ?
FAB22 - 133,000 sq. ft.
FAB24 - is this one still on hold?
Intel DIBR - Hillsboro, OR; Renovations and a new addition to an existing sub-class 1 clean room totaling 200,000 sq. ft.
masselec.com
Intel, the world's largest maker of computer chips, announced that it would commit 29 percent of its entire year's capital expansion budget to a single project: the $2 billion wafer fab expansion at the company's FAB 7 site in Rio Rancho. Full production capacity at what will be the world's largest cleanroom manufacturing site (435,000 sq. ft./40,412 sq. m.) is projected for 2002.
siteselection.com
The company recently received the green light from the city council to begin construction of the plant, called Fab 22 (near FAB 12). At least 133,000 of the new plant's 360,000 sq ft will be cleanroom area.
micromagazine.com
Intel Corporation Fab D-1A 200mm wafer Fab Class 1 Aloha, OR
fprinc.com
The D1C fab houses a 135,000-sq-ft cleanroom that, Intel says, features the world's first automation system with multiple layers of interconnected transport tracks.
micromagazine.com
Intel designs, manufactures and markets microcomputer components and related products at various levels of integration. Intel's principal components consist of silicon-based semiconductors etched with complex patterns of transistors.
[1998 FAB listing - many of the .25 FABs were converted to .18 or .13, while at least a few have likely been shut down]
- Fab 1, Santa Clara (in the heart of the Silicon Valley, about 45 miles south of San Francisco), Califonia, USA: 2200 Mission College Blvd., Santa Clara, CA 95052-8119. Tel: 408-765-8080, Fax: 408-765-9904
- D2, Folsom (In the foothills of the Sierra Nevada, about 15 miles east of Sacramento), California, USA (0.25 micron process technology. 1900 Prairie City Road, Folsom, California 95630-9599, USA): Tel: 916-356-8080, Fax: 916-956-5427
- Fab 4, The Portland suburbs of Hillsboro, Aloha, and Beaverton, Oregon, USA (opened in 1976 and decommissioned in December 1996 after more than 20 years of operation, host Intel's largest site worldwide. A fab is under construction to manufacture the next generation of 300mm wafers at this location): 2111 NE 25th Street, Hillsboro, Oregon 97124, USA. Tel: 503-696-8080
- Fab 5 (also called D1), Hillsboro, Oregon, USA:
- Fab 6, Chandler (about 25 miles south of downtown Phoenix), Arizona , USA: 5000 W. Chandler Blvd., Chandler, Arizona 85226-3699, USA. Tel: 602-554-8080
- Fab 7, Rio Rancho, New Mexico, USA (Flash Memory): 4100 Sara Road, Rio Rancho, New Mexico 87124-1024, USA. Tel: 505-893-7000
- Fab 8, Jerusalem, Israel, Intel's first international wafer fab (a major supplier of Intel486™ processors, PCI chipsets, microcontrollers and other products using 150 mm wafers and 0.8 micron processes.): Intel Electronics Ltd., POB 3173, Jerusalem 91031 Tel. (972)2-897111, started production in 1985.
- Fab 9, Rio Rancho, (14 miles northwest of downtown Albuquerque and just one hour from Santa Fe), New Mexico, USA (Flash Memory): 4100 Sara Road, Rio Rancho, New Mexico 87124-1024, USA. Tel: 505-893-7000
- Fab 10, Leixlip (just outside of Dublin), Ireland, next to Fab 14: opened in 1993 and conversion to the 0.25 micron process technology is expected to be completed in 1999.
- Fab 11 Rio Rancho, New Mexico, USA (0.25 micron process technology): 4100 Sara Road, Rio Rancho, New Mexico 87124-1024, USA. Tel: 505-893-7000
- Fab 12, Ocotillo, Arizona, USA: 0.25 micron process technology. starting in early 1997, manufacture Intel's advanced microprocessor products.
- Fab 14, Leixlip (just outside of Dublin), Ireland (produce advanced microprocessors -- such as the Pentium® II, Pentium® II Xeon™, and Intel ® Celeron™ processors ): the first 0.25 micron microprocessor production factory within Europe opened in 1998.
- Fab 16, Fort Worth, Texas, USA (advanced logic products on 0.25 micron technologies and then progress to smaller geometries in the future.): an advanced logic wafer fabrication plant, scheduled to be operational by 1999.
- Fab18, Kiryat Gat (approximately 35 miles from Jerusalem), Israel (flash memory chips): slated to start production in 1998.
- Fab 20, 300 millimeter advanced logic wafer fabrication facility at the Ronler Acres campus in Hillsboro, Oregon., USA: Ground broken on 18 Feb. 1998
- Hudson, Mass., USA: acquired from Digital Equipment Corp.Digital’s 64-bit Alpha microprocessors.
geocities.com.
Intel may be forced to cut back capital and R&D spending, which could hamper a quick ramp up of the 0.13-micron process that is essential to bringing Pentium 4 into the mainstream. "The Fab 24 opening delay and associated 0.13-micron capacity reduction could lead to a shortage similar to one that occurred in late 1999 and early 2000, when the company did not have sufficient capacity to meet rapidly increasing demand for the Coppermine-based Pentium III," says Kevin Krewell, Senior Analyst with In-Stat/MDR's Intel PC Processor Service.
mdronline.com
So, there are 1,038,000 sq. ft. from 5 of the FABs. If the other 15 average 75,000 sq. ft., then Intel's total is 2,163,000 sq. ft. to produce 2/3's the flash and 3 times the CPUs of AMD's 470,000.
Notes:
Some of Intel's FABs are still being ramped, and some older FABs are used for comm chips, chipsets, etc. But AMD's Dresden FAB isn't yet completed and two new processes, .13 and SOI are currently at different stages of ramping there. AMD's Austin FAB is in the process of being converted to flash. AMD also produces its embedded processors and networking chips at these facilities, as well as acting as a foundry for analog comm chips and programmable logic devices.
FAB 12 size estimate taken from ....will expand the cleanroom section of the Fab 12 facility, where Intel manufactures its popular Pentium products. Sources say the addition will provide 30,000 square feet more of cleanroom manufacturing space.
...the Fab 12 expansion "fairly significant," adding that it could boost Intel's production at the facility by as much as 20 percent. [30,000 is 20% of 150,000, but I'll estimate it at 135,000 because of that "as much as"] |
