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Technology Stocks : Intel Corporation (INTC)

INTC 45.51

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3:59 PM EST

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To: semiconeng who wrote (153840)	1/5/2002 1:40:59 AM
From: Saturn V	Read Replies (3) of 186894

Ref < Nobody wants to spend millions on a piece of equipment, to have poor Cross Wafer Sigma. It just doesn't happen anymore. More likely, the variations you would see on edge die are most likely bin split related. Maybe that's what you meant by yield?? > I am glad that you are so confident. However my experience shows that continuous scaling and shrinking brings new problems to light which were not considered to be an issue historically . Thus the process parameters which affect these `unrecognized problems' are not monitored. And sometimes such `hidden problems' ( manifested as yield and reliability problems ) frequently lurk on the edge of wafers, and go ignored. A Wafer Size Increase thus suddenly expose these problems. For example both you and Elmer referred to poorer bin splits and reliability on the edges. Enlarging the wafer obviously will make these issues worse. However these problems are not fundamental, and once recognized, they are solved by diligent engineering. So my model is that the effective yield will not reach the potential value for six to nine months. As an Intel shareholder I hope that my pessimism is unwarranted.

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