Anyone want to venture and guess who might be the lucky owner of a brand new 300mm Momentum? Micron? Infineon? Samsung?
Anyway, here's the full press release....
SpeedFam-IPEC To Place 300-mm CMP Tool With Top-10 Device Manufacturing Group
300-mm DRAM Fab Leverages Production Benefits Of Momentum Orbital Hard-Platen CMP Technology
CHANDLER, Ariz.--(BUSINESS WIRE)--Jan. 7, 2002--SpeedFam-IPEC, Inc. (Nasdaq: SFAM - news), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, announced today that it will place a 300-mm orbital hard-platen CMP system with a top-10 device manufacturing group. Momentum300(TM) will be used in the volume production of advanced DRAM products at a leading-edge fab with an already-established 300-mm line.
Currently, there are more than 20 Momentum(TM)-based CMP tools on order or installed at fabs and foundries in the United States, Europe and Asia. The 300-mm system slated for placement with this global integrated circuit (IC) manufacturing group will utilize shallow trench isolation (STI) and tungsten processes at the 0.13-micron and below technology nodes.
``Two of Momentum300's key benefits -- factory productivity and yield performance -- are recognized as key evaluation metrics for CMP equipment. Because our customer is committed to running 300-mm production volume, this tool placement will demonstrate the readiness of Momentum300 in a mass production environment,'' said SpeedFam-IPEC President and CEO Richard Faubert.
``Our system's innovative orbital hard-platen architecture offers advanced chip makers an edge when it comes to reliability, economical extendibility, low cost of ownership, process flexibility and wafer profile tuneability at and below 0.13 micron,'' he added. ``Momentum300 delivers competitive cost of ownership when it comes to production-worthy, leading-edge technology with multiple-device generation extendibility.''
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With more than 1,300 CMP systems installed worldwide, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on Nasdaq under the symbol SFAM. The company's web site URL is www.sfamipec.com.
This news release contains forward-looking statements related to our Momentum300(TM) product, our prospects for growth and the semiconductor industry in general. Actual results may vary. Although initial customer reaction to Momentum300 has been positive and we anticipate growth for the company at the next industry upturn, an industry upturn may not occur in the foreseeable future and, if it does, sales of Momentum may not occur on the scale or in the time frame that we anticipate. For instance, roll-out of Momentum300 tools may be slowed due to manufacturing problems, unforeseen technical problems with Momentum technology or changes in the CMP marketplace that differ from our expectations. See SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001, and the Quarterly Report on Form 10-Q filed on October 11, 2001, for additional risks affecting the company.
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Contact:
SpeedFam-IPEC, Inc.
Tamara M. Berry, 480/705-2473 (Marketing Communication)
tberry@sfamipec.com
Lisa Lyscio, 480/705-2119 (Investor Relations)
llyscio@sfamipec.com |
