SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Intel Corporation (INTC)
INTC 45.07-17.0%Jan 23 9:30 AM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: combjelly who wrote (157576)2/3/2002 11:13:24 AM
From: semiconeng  Read Replies (1) of 186894
 
I guess that depends on how you define "leader"...

---One definition might be having the leading process technology.....
The first 0.13-micron flash memory. infosatellite.com;

---Also, EE Times Certainly seems to think intel is the Flash leader.
http://www.eetimes.com/story/OEG20000906S0035
STMicro is following Intel Corp. into multi-level cell technology. Intel, the flash memory market leader, has offered a multi-level cell (MLC) technology called Strataflash since 1998.


---And EVEN IF, they weren't a leader before, as this article suggests, the industry seems to agree that they're one now.
http://news.com.com/2009-1040-257837.html?legacy=cnet
Intel is not among the leaders today, except for being a major supplier of flash memory in mobile handsets. However, with this announcement, Intel has become virtually the only chipmaker to offer a process that integrates microprocessor, digital signal processor (DSP), analog capabilities and high-complexity flash memory into a single chip. Few companies own all those technologies--let alone are able to incorporate them all in a single manufacturing process.


---Looks like leadership to me. Oh by the way, if you were about to mention this:

However, Intel's chip does not offer the only reasonable approach to putting more processing power in the same space. For example, Texas Instruments, today's leader in supplying mobile baseband solutions, handles three of the four components--microprocessors, DSPs and analog capabilities. Through an agreement with Advanced Micro Devices, TI physically integrates AMD's flash chips into its mobile multimedia solution, called OMAP (Open Multimedia Applications Platform), by a technique called "stacking." With stacking, a handset manufacturer could design a chip stack in which the AMD flash memory sits directly on top of TI's microprocessor/DSP.

---Stacked chips? Got those too: intel.com

TI's approach does not seem as elegant as Intel's, but good marketing could make the difference. The real question is not which chipmaker has the best technology and engineering, but which will do a better job of convincing customers that its approach is better.

---Marketing..... Hummmmm..... Wonder who's got the lead there...

Semi
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext