QUALCOMM Announces radioOne WCDMA/UMTS Multimode Chipset; radioOne
RELATED SYMBOLS: (QCOM)
SAN DIEGO, Feb 4, 2002 (BUSINESS WIRE) -- QUALCOMM Incorporated (Nasdaq: QCOM),
pioneer and world leader of Code Division Multiple Access (CDMA) digital
wireless technology, today announced the radioOne(TM) 6200 chipset, consisting
of the RTR6200(TM), RFL6200(TM) and RFR6200(TM) direct conversion multimode
chips. The radioOne 6200 solution offers a fully integrated
transceiver/transmitter for Global System for Mobile Communications (GSM) and
Wideband CDMA (WCDMA) -- also known as Universal Mobile Telecommunications
System (UMTS) -- systems. The radioOne 6200 solution interfaces directly with
the QUALCOMM CDMA Technologies (QCT) MSM6200(TM) Mobile Station Modem (MSM(TM))
baseband processor and supports tri-band UMTS devices, using GSM-900, GSM-1800
or International Mobile Telecommunications (IMT) bands.
"QCT's radioOne 6200 RF solution, designed specifically to address the needs of
the European market, offers one of the highest levels of integration we have
seen in the industry," said Don Schrock, president of QUALCOMM CDMA
Technologies. "This level of integration will allow manufacturers to produce
cost-effective multimode 3G handsets for the GSM and WCDMA/UMTS marketplace."
The radioOne Zero Intermediate Frequency (Zero IF) architecture eliminates the
need for IF components -- including IF integrated circuits (ICs), IF Surface
Acoustic Wave (SAW) filters and IF voltage controlled oscillators (VCOs) --
thereby reducing printed circuit board (PCB) area and Bill of Material (BOM)
costs for future wireless handsets and other devices, enabling more
cost-effective multimode, multiband phones.
The RTR6200 chip provides an integrated GSM/GPRS transceiver for GSM-900 and
GSM-1800 bands. The GSM receivers consist of low noise amplifiers (LNAs), direct
conversion mixers and filtering, while the GSM transmitters consist of an
upconversion modulator and offset phase locked loop (PLL). Also integrated in
the RTR6200 chip is a transmitter for WCDMA in the IMT band, which includes the
I/Q upconversion modulator, ultra high frequency (UHF) PLLs and a transmit
voltage controlled oscillator (VCO) for WCDMA. The RTR6200 chip is fabricated
with a silicon germanium (SiGe) bipolar complementary metal oxide semiconductor
(BiCMOS) process, thus permitting high linearity and low power consumption, and
is available in a 7X7 millimeter (mm) bump chip carrier 48-pin (BCC48++)
package.
The WCDMA receive function in the radioOne 6200 solution is performed by the
RFL6200 chip, which is an LNA, and by the RFR6200 chip, which contains the
direct conversion mixer and local oscillator (LO) generator. The RFL6200 chip is
offered in a 4X4 mm 16-pin BCC++ package, while the RFR6200 chip is offered in a
6X6 mm 40-pin BCC++ package. Both chips are fabricated in SiGe BiCMOS.
The MSM6200 chipset and system software, QUALCOMM's WCDMA/UMTS/GSM/GPRS MSM
solution, supports data rates of up to 384 kilobits per second (kbps), and is
compatible with the Wireless Internet Launchpad(TM) suite of advanced
technologies and software, including Bluetooth(TM) connectivity capabilities,
UMTS Subscriber Identity Module (SIM), and multimedia features such as
Qtunes(TM) Moving Picture Experts Group (MPEG-1) Layer-3 (MP3) player software
support. In addition to offering these features, the MSM6200 chips support
QUALCOMM's Binary Runtime Environment for Wireless(TM) (BREW(TM)) applications
platform.
Samples of the radioOne 6200 solution are expected to be available in the third
quarter of calendar 2002. |
