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Technology Stocks : Intel Corporation (INTC)

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To: wanna_bmw who wrote (158732)	2/14/2002 5:15:31 PM
From: ptanner	Read Replies (1) of 186894

wbmw, re: "I thought the organic packaging was better." I haven't seen one of the organic packages first hand... but prefer the ceramic as it just seems more solid. You later ask, "I believe the ceramic package was also prone to cracking when certain heatsinks were applied on top of it." I cannot recall ever seeing information on the ceramic packaging breaking. I have chipped one of the CPUs itself during a HSF install as the silicon is quite brittle. Intel's solution for providing high-pressure (65-80 lbs vs 20 for AMD) HSF installation looks pretty nice and even without the heat spreader/cap would provide for a more effective and safer solution. Intel's tech docs even had a nice graph of the decrease in thermal resistance through the interface material (IHS -> goop -> heatsink) for changing HSF force. EDIT: I had a question after my first post on the MP vs XP question. In testing a die for MP suitability, could this be done prior to packaging? -PT

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