Some News::
Friday February 15, 6:00 am Eastern Time
Press Release
SOURCE: Irvine Sensors Corporation
Irvine Sensors Unit Shipping New Commercial Memory Part
COSTA MESA, Calif., Feb. 15 /PRNewswire-FirstCall/ -- Irvine Sensors Corporation (Nasdaq: IRSN; Boston Stock Exchange: ISCB) announced today that its Microelectronics Products Division (``MPD'') has introduced and started shipping a new line of stacked memory products for commercial applications. The new line involves DRAM, SRAM and Flash memory products that exactly match the ``footprint'' of the next generation Thin Small Outline Package (``TSOP'') integrated circuits that they emulate. The new line, referred to by MPD as ``Skinny Stacks,'' eliminates any width overhang found in older generation products, resulting in a narrower package that will fit into all the popular new compact card applications. Skinny Stacks are available in 2-high, 4-high and 8-high packages, allowing customers to emulate virtually any advanced memory configuration desired. MPD is quoting delivery times of 5 working days for commercial grade orders involving open stock or customer consigned memory. For further product information or to place orders, contact John Hardacre, MPD's Sales Manager, at (714) 444-8927, or jhardacre@irvine-sensors.com.
``The introduction of this new family of products and qualification of our manufacturing line for commercial orders are important steps in the evolution of our business,'' said Floyd Eide, General Manager of MPD. ``We have seen a strong interest from potential customers for products with this form factor. Customers can employ advanced designs at reduced costs by using Skinny Stacks to emulate new and more expensive memory packages. Furthermore, the exact footprint match of the Skinny Stack allows for a seamless transition to the advanced monolithic memory parts when their costs become more affordable. At that point, the cycle can start all over again by using Skinny Stacks to emulate the next generation of advanced memory.'' |
