I would have assumed that Fab 11x starts up on 0.13 micron/300MM processing.
Paul
Oh yeah, I don't mean can intel actually DO the startup, it's just that I recall that there seemed to be allot of building infrastructure in F11x that had to be changed to convert it.
F11x is actually a combination of the old Fab7/Fab9 structures that had to be combined, gutted, attached to the current Fab11 and retrofitted with the new equipment. Granted, I haven't been paying too much attention to the New Mexico Guys lately, but just doing all that work in that timeframe seemed quick. Hey, maybe New Mexico Building Contractors are really really speedy.
In any case, SOME of the "other folk" took my statement to suggest that intel's 300mm 0.13u won't be ready by then. That's my communication error. I wasn't saying that at all, I'm pretty sure that it's ready now. I believe that intel is most likely already cranking out functional die, on 300mm 0.13u wafers at D1C. I was simply questioning (admiring?) the retrofit and construction speed of intel's Building Contractors, and the I/Q (Install/Quall) people, that's all.
I've never put up a Fab wall, or installed a tool, so really.... what the heck do I know???
:-)
Semi |
