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Technology Stocks : Intel Corporation (INTC)

INTC 48.80

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To: Windsock who wrote (159169)	2/18/2002 4:31:23 PM
From: Elmer	Read Replies (1) of 186894

A system level test socket for testing semiconductor packages having non-pin grid array footprints. The test socket having solder pads positioned on the test socket to form electrical connections with corresponding leads on the bottom of the semiconductor package. The test socket has internal connections connecting each solder pad with a corresponding connection on the bottom of the test socket. The test socket is mounted on a burn-in board, thus allowing a semiconductor package having a non-pin grid array footprint to be tested without requiring an interposer for converting the non-pin grid array footprint of the semiconductor package. In addition, the test socket includes guide posts which align with guide slots on a hydraulic cylinder. The hydraulic cylinder compresses the semiconductor package to the test socket thereby ensuring solid connections between the semiconductor package and test socket. This would be laughed out of any court in the land. There is absolutely nothing new or unique in any of these patents. EP

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