Tuesday February 19, 3:30 am Eastern Time
Press Release
SOURCE: Broadcom Corporation
Broadcom Demonstrates Widest Range of Short-Range Wireless Technologies At 3GSM World Congress in Cannes This Week
Bluetooth(TM) and Wi-Fi(TM) Products Comprise Company's Offering of Chips And Systems for End-to-End Wireless and Mobile Connectivity
CANNES, France, 3GSM World Congress, Feb. 19 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM - news), the leading provider of integrated circuits enabling broadband communications, will demonstrate its new products for wireless communications at the 3GSM World Congress in Cannes, France, February 19 -22, 2002. Demonstrations include the company's recently announced chips for wireless local area networking (WLAN) based on the 802.11b (Wi-Fi(TM)) standard, as well as chips and systems for Bluetooth(TM) applications.
As mobile phone technologies such as GSM (Global Standard for Mobile Communications) evolve to provide advanced, high speed data services, short-range wireless technologies become increasingly useful for distributing this data among mobile phones, notebooks and handheld computers. Broadcom's families of chipsets for short-range wireless communications leverage the company's extensive experience in broadband communications and RF design in standard CMOS technology, and have been designed to complement mobile communications and computing platforms.
``The rapid evolution of network technology and applications in the last decade revealed the benefits of effectively connecting intelligent multimedia devices. Broadcom is applying this lesson to the mobile device market,'' said Dr. Henry T. Nicholas III, President and CEO of Broadcom. ``We've developed our industry-leading Bluetooth and 802.11b Wireless LAN products with consideration of how these short-range wireless technologies will best address the evolving mobile data market. Our demos at the 3GSM World Congress highlight our considerable capabilities in these areas.''
``As an established supplier of chips for several different broadband communications markets, such as cable and Ethernet, Broadcom is now quickly establishing itself as a provider of high-performance solutions in the wireless space,'' said Jeff Thermond, Vice President and General Manager of Broadcom's Home Networking Business Unit. ``Our products are built to provide excellent radio performance in noisy environments such as the mobile phone. Additionally, their low power consumption and low CPU utilization make them ideal for battery powered portable devices.''
At the Congress, Broadcom will show its products for Bluetooth and 802.11b WLAN. The unique architecture of Broadcom's chips allows cellular handset providers the ability to add personal and local area connectivity to complement the new 2.5G and 3G wide area services being deployed by cellular carriers today. Broadcom's demonstration will feature a recently announced Bluetooth headset reference design with outstanding audio quality and talk times. This headset is a natural compliment to Bluetooth-enabled handsets.
Broadcom will show its Blutonium(TM) line of Bluetooth devices. Bluetooth is a cable-replacement technology for wireless data applications with lower power, size and bandwidth requirements than WLAN. The standard was designed to enable wireless short-range sharing of digital information at around one Megabit per second (Mbps). The family of products includes the Broadcom® BCM2033, a fully integrated Bluetooth systems solution incorporating radio and baseband functions onto a single device, the BCM2002, a radio-only device that can be used in applications where the Bluetooth baseband already exists in the host device, and the BCM2013, a full, single chip Bluetooth wireless headset solution providing unparalleled audio performance for hands-free connections to mobile phones.
Broadcom's new Wi-Fi WLAN integrated circuits provide up to 11 Mbps of connectivity and are designed for enterprise, small business, home, and public access applications. The Broadcom BCM2051 2.4GHz direct-conversion radio and the BCM430x family of baseband processors contain a number of industry-first innovations. These silicon solutions are the first IEEE 802.11b-compliant chipsets to be implemented in a standard digital CMOS process, which represents the lowest possible silicon cost approach to wireless radio and will enable new product price points via chipset integration as well as a smaller solution footprint, which is important for portable devices. The chipsets also provide the many advantages of a direct-conversion radio architecture, superior performance in hostile multi-path signal environments, and built-in hardware support for current and forthcoming enhanced wireless encryption standards.
Arrangements to view Broadcom's demonstrations can be made at Booth #J36 in Hall 3 at the 3GSM World Congress in Cannes.
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