Global Q4 MOS chip-making capacity 1.17 mln starts/wk vs 1.21 in Q3
e-insite.net
-- AFX - Asia, 2/21/2002
Worldwide integrated circuit fabrication capacity using
MOS technology fell to 1.17 mln wafer starts per week in the fourth quarter to
December from 1.21 mln in the third quarter, Semiconductor International
Capacity Statistics (SICAS) said.
In the fourth quarter, sub-0.20 micron scale MOS output rose to 325,800
wafer starts per week from 317,200 in the third quarter, while plus-0.70 micron
scale MOS output declined to 230,300 wafer starts a week from 245,200
previously.
In the fourth quarter, 0.4-0.7 micron MOS output decreased to 193,400 wafer
starts per week from 209,300 in the previous quarter, SICAS said.
Bipolar technology capacity declined to 281,500 wafer starts per week in
the fourth quarter from 291,600 in the second.
Combined MOS and bipolar capacity utilisation increased to 65.9 pct in the
fourth quarter from 64.2 pct in the third, SICAS said.
MOS utilisation alone also rose to 66.1 pct in the fourth quarter from 64. 0
pct in the second, while bipolar utilisation fell to 63.7 pct from 65.6 pct.
bur/rc
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