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Politics : Formerly About Applied Materials

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Nov 14 9:30 AM EST

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To: StanX Long who wrote (61379)	3/4/2002 10:49:04 PM
From: StanX Long	Read Replies (1) of 70976

Major hurdles still threaten next-generation lithography, says Sematech CEO By Mark LaPedus Semiconductor Business News (03/04/02 16:07 p.m. EST) siliconstrategies.com SANTA CLARA, Calif. -- IC manufacturers must continue to develop new, high-density devices to ensure growth in the latter part of this decade, but future lithography technologies may not be ready in time to make these next-generation devices, warned the head of International Sematech here today. Speaking at the opening of the SPIE Microlithography conference here, C. Robert Helms, president and CEO of Austin, Tex.-based Sematech, said the industry still faces some major challenges to develop and deliver both 157-nm and next-generation lithography (NGL) tools for use in chip making by 2005 or beyond. "For three to five years out, I see some risks [in lithography]," Helms said. "Maybe 157-nm [tools] will not out be on time. There are also some major challenges with EUV [extreme ultraviolet technology]," he said in an interview with SBN after the presentation. EUV is considered by many experts to be the leading candidate for NGL.

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