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Technology Stocks : Intel Corporation (INTC)

INTC 37.81

-4.3%

Dec 12 9:30 AM EST

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To: wanna_bmw who wrote (162408)	3/18/2002 12:53:55 AM
From: maui_dude	Read Replies (1) of 186894

bmw, Re : "I've been under the impression that extra metal layers are a liability, rather than an asset." Designs could certainly absorb one or two extra layer every new process. Intel has 1 extra layer for 0.09 and that would help their design teams a lot. (BTW, I find it impossible to believe that AMD got 3 additional layers on their .09 process - somebody must be counting poly as a routing layer). At smaller processes like 0.09, the shielding of signals becomes critical (due to cross-check problems). You start needing additional layer just to keep your logic of larger processes functional (like routing to repeaters, decoupling capacitors, etc). At .13 and lower, interconnect is a big limitor (not devices) and the more the metal layer available the merrier to help improve die size, functionality and productivity. My guess is that the cost for 1 additional layer is insignificant compared to the gains from it. Maui.

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